Abstract: Certain example embodiments relate to the use of a ceramic frit that dissolves an already-applied thin film coating (disposed via a physical vapor deposition (PVD) process such as sputtering, or other suitable process). In certain example embodiments, the ceramic frit is aggressive in chemically removing the coating on which it is disposed, e.g., when exposed to high temperatures. The frit advantageously fuses well with the glass, provides aesthetically desired colorations, and/or enables components (e.g., insulated glass (IG) unit spacers) to be reliably mounted thereon, in certain example embodiments. Associated coated articles, IG units, methods, etc., are also contemplated herein.

Abstract: Certain example embodiments relate to heating a ceramic paint applied to a portion of a coated article in order to at least partially “eat through” the underlying coating, with any remaining materials being removable by washing, and associated articles. In certain example embodiments, the coatings are multilayer sputter-deposited coatings formed on a glass or other substrate. The heat may be provided in connection with conventional heat treatment (e.g., thermal tempering) and/or heat bending processes that otherwise would be performed on the coated article.

Abstract: Certain example embodiments relate to heating a ceramic paint applied to a portion of a coated article in order to at least partially “eat through” the underlying coating, with any remaining materials being removable by washing, and associated articles. In certain example embodiments, the coatings are multilayer sputter-deposited coatings formed on a glass or other substrate. The heat may be provided in connection with conventional heat treatment (e.g., thermal tempering) and/or heat bending processes that otherwise would be performed on the coated article.

Abstract: For simplified projection of a cascaded fieldbus system which includes a first fieldbus with a plurality of first bus devices, a second fieldbus subordinate to the first fieldbus with a plurality of second bus devices and a third fieldbus subordinate to the second fieldbus with a plurality of third bus devices, an example embodiment of the invention provides that the second fieldbus is connected to the first fieldbus via a fieldbus access node device, and therefore bus devices of the second fieldbus are presented as virtual modules of the first fieldbus, and that a connection device, via which the third fieldbus is connected to the second fieldbus, is presented as a virtual fieldbus access node module of the first fieldbus, and therefore the remaining bus devices of the third fieldbus are presented as virtual modules of the first fieldbus.

Abstract: Certain example embodiments relate to the use of a ceramic fit that dissolves an already-applied thin film coating (disposed via a physical vapor deposition (PVD) process such as sputtering, or other suitable process). In certain example embodiments, the ceramic frit is aggressive in chemically removing the coating on which it is disposed, e.g., when exposed to high temperatures. The frit advantageously fuses well with the glass, provides aesthetically desired colorations, and/or enables components (e.g., insulated glass (IG) unit spacers) to be reliably mounted thereon, in certain example embodiments. Associated coated articles, IG units, methods, etc., are also contemplated herein.

Abstract: For simplified projection of a cascaded fieldbus system which includes a first fieldbus with a plurality of first bus devices, a second fieldbus subordinate to the first fieldbus with a plurality of second bus devices and a third fieldbus subordinate to the second fieldbus with a plurality of third bus devices, an example embodiment of the invention provides that the second fieldbus is connected to the first fieldbus via a fieldbus access node device, and therefore bus devices of the second fieldbus are presented as virtual modules of the first fieldbus, and that a connection device, via which the third fieldbus is connected to the second fieldbus, is presented as a virtual fieldbus access node module of the first fieldbus, and therefore the remaining bus devices of the third fieldbus are presented as virtual modules of the first fieldbus.

Abstract: The various embodiments herein provide nucleic acid sequences isolated from Pseudomonas putida strain P13 encoding a family of APases including a phytase and a sugar phosphatase which are highly active at a temperature of 60° C. and at a broad range of pH and withstand the harsh conditions of food processing and digestive system of animals. The enzymes are active at a wide temperature range of 20° C. to 75° C. and at a pH of 5. The embodiments also provide a method of production of the APases. The embodiments also provide a method of isolation and cloning of the APases.

Abstract: The various embodiments herein provide nucleic acid sequences isolated from Pseudomonas putida strain P13 encoding a novel family of APases including a phytase and a sugar phosphatase which are highly active at a temperature of 60° C. and at a broad range of pH and withstand the harsh conditions of food processing and digestive system of animals. The enzymes are active at a wide temperature range of 20° C. to 75° C. and at a pH of 5. The embodiments also provide a method of production of the novel APases. The embodiments also provide a method of isolation and cloning of novel APases.

Abstract: A circuit carrier assembly includes a plurality of substrates directly secured together by an electrically conductive securing substance. In one example, the securing substance is a conductive epoxy. In another example, the electrically conductive securing substance is solder. Still another example includes a combination of solder and conductive epoxy. A non-conductive epoxy provides further mechanical connection and thermal conductivity between the substrates while also electrically isolating selected portions of the substrates in one example. The electrically conductive securing substance not only mechanically secures the substrates together and provides thermal conductivity between the substrates, which increases the thermal capacitance of the assembly, but also establishes at least one electrically conductive path between the substrates.

Abstract: A circuit carrier assembly includes a plurality of substrates directly secured together by an electrically conductive securing substance. In one example, the securing substance is a conductive epoxy. In another example, the electrically conductive securing substance is solder. Still another example includes a combination of solder and conductive epoxy. A non-conductive epoxy provides further mechanical connection and thermal conductivity between the substrates while also electrically isolating selected portions of the substrates in one example. The electrically conductive securing substance not only mechanically secures the substrates together and provides thermal conductivity between the substrates, which increases the thermal capacitance of the assembly, but also establishes at least one electrically conductive path between the substrates.