Patents by Inventor Ralf Heidenreich

Ralf Heidenreich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and method for purifying a process gas in a reflow soldering system
    Patent number: 8518157
    Abstract: Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged from the receptacle after penetrating the packing bed. The inventive device further comprises an apparatus for delivering a liquid fluid to the receptacle. Secondary materials of the soldering process in the reflow soldering system can be absorbed by the liquid fluid and thus be eliminated from the process gas. Secondary materials and/or droplets and vapors of the fluid can additionally be absorbed and adsorbed on the surface of the packing.
    Type: Grant
    Filed: February 20, 2006
    Date of Patent: August 27, 2013
    Assignee: Rehm Thermal Systems GmbH
    Inventors: Hans Bell, Jürgen Felgner, Ralf Heidenreich
  • Device and Method for Purifying a Process Gas in a Reflow Soldering System
    Publication number: 20080276801
    Abstract: Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged from the receptacle after penetrating the packing bed. The inventive device further comprises an apparatus for delivering a liquid fluid to the receptacle. Secondary materials of the soldering process in the reflow soldering system can be absorbed by the liquid fluid and thus be eliminated from the process gas. Secondary materials and/or droplets and vapors of the fluid can additionally be absorbed and adsorbed on the surface of the packing.
    Type: Application
    Filed: February 20, 2006
    Publication date: November 13, 2008
    Applicant: Rehm Anlagenbau GmbH
    Inventors: Hans Bell, Jurgen Felgner, Ralf Heidenreich