Abstract: An integrated circuit and an arrangement including a semiconductor device and a connecting element and method for producing such an arrangement is disclosed. One embodiment provides a semiconductor element having a first contact face and a second contact face. The first contact face and the second contact face extend in a first lateral direction. An electrically conductive connecting element which has a third contact face electrically contacts the semiconductor element. The connecting element includes a trench system. A first trench of this trench system extends from the third contact face into the connecting element.

Abstract: An integrated circuit and an arrangement including a semiconductor device and a connecting element and method for producing such an arrangement is disclosed. One embodiment provides a semiconductor element having a first contact face and a second contact face. The first contact face and the second contact face extend in a first lateral direction. An electrically conductive connecting element which has a third contact face electrically contacts the semiconductor element. The connecting element includes a trench system. A first trench of this trench system extends from the third contact face into the connecting element.

Abstract: The inventive electronic power module is provided for effecting the smooth starting of motors. The module essentially includes two semiconductor elements, which are connected in an electrically anti-parallel manner and which are clamped between two metal bars, having a high thermal capacity, e.g. made of copper, by a pressing device. After being intermediately stored in the metal bars, the heat loss of the semiconductor elements is dissipated by cooling bodies placed on the metal bars.

Abstract: In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.