Abstract: A method for processing a transparent workpiece that includes directing a laser beam the transparent workpiece. The laser beam incident to the impingement surface has an oblong angular spectrum and portion of the laser beam directed into the transparent workpiece is a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength ?, a spot size wo, a Rayleigh range ZR that is greater than F D ? ? ? ? w o 2 ? , where FD is a dimensionless divergence factor comprising a value of 10 or greater, and an internal beam angle of greater than 10° relative to a plane orthogonal to an impingement surface at an impingement location, such that the defect has a defect angle within the transparent workpiece of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.

Abstract: A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.

Abstract: A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.

Abstract: A method including emitting a laser beam toward a transparent workpiece such that portions of the laser beam pass through openings of a beam shaping structure and form corresponding laser beam focal lines across the transparent workpiece. The laser beam focal lines forming a plurality of defects in the transparent workpiece disposed along a contour line. The method further including separating the transparent workpiece along the contour line to provide a first workpiece section and a second workpiece section and a cut edge surface on each of the first and second workpiece sections, each cut edge including a defect region and an unaffected region. The defect region having a higher surface roughness than the unaffected region and a minimum distance of the unaffected region to the first major surface being about 20% or less of a thickness between the first major surface and the second major surface.

Abstract: A method of forming a plurality of defects within a substrate with a laser beam focal line using a laser beam, each defect of the plurality of defects being a damage track within the substrate with a diameter of about 10 microns or less, the plurality of defects forming a contour line on the substrate. The substrate having a first surface and a second surface that is opposite from the first surface. The method further includes exerting (i) a first force on the first surface of the substrate at a location that is adjacent to the contour line and (ii) a second force on the second surface of the substrate at a location that is on the contour line. Additionally, the method includes breaking the substrate along the contour line and into a first substrate portion and a second substrate portion.

Abstract: A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tbd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength ?, a spot size wo, and a Rayleigh range ZR that is greater than F D ? ? ? w o 2 ? , where FD is a dimensionless divergence factor comprising a value of 10 or greater.

Abstract: A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other.

Abstract: A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other.

Abstract: A method for processing a transparent workpiece that includes directing a laser beam the transparent workpiece. The laser beam incident to the impingement surface has an oblong angular spectrum and portion of the laser beam directed into the transparent workpiece is a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength ?, a spot size wo, a Rayleigh range ZR that is greater than F D ? ? ? ? w o 2 ? , where FD is a dimensionless divergence factor comprising a value of 10 or greater, and an internal beam angle of greater than 10° relative to a plane orthogonal to an impingement surface at an impingement location, such that the defect has a defect angle within the transparent workpiece of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.

Abstract: A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.

Abstract: A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.

Abstract: A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other.