Patents by Inventor Ralf Jorke

Ralf Jorke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic power module
    Patent number: 7027303
    Abstract: The inventive electronic power module is provided for effecting the smooth starting of motors. The module essentially includes two semiconductor elements, which are connected in an electrically anti-parallel manner and which are clamped between two metal bars, having a high thermal capacity, e.g. made of copper, by a pressing device. After being intermediately stored in the metal bars, the heat loss of the semiconductor elements is dissipated by cooling bodies placed on the metal bars.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: April 11, 2006
    Assignee: Siemens Aktiengesellschaft
    Inventors: Walter Apfelbacher, Heinrich Gerstenköper, Ralf Jörke, Elmar Krause, Gerhard Mewissen, Norbert Reichenbach
  • Electronic power module
    Publication number: 20040120096
    Abstract: The inventive electronic power module is provided for effecting the smooth starting of motors. The module essentially includes two semiconductor elements, which are connected in an electrically anti-parallel manner and which are clamped between two metal bars, having a high thermal capacity, e.g. made of copper, by a pressing device. After being intermediately stored in the metal bars, the heat loss of the semiconductor elements is dissipated by cooling bodies placed on the metal bars.
    Type: Application
    Filed: June 20, 2003
    Publication date: June 24, 2004
    Inventors: Walter Apfelbacher, Heinrich Gerstenkoper, Ralf Jorke, Elmar Krause, Gerhard Mewissen, Norbert Reichenbach
  • Spring clip for fixing semiconductor modules to a heat sink
    Patent number: 6431259
    Abstract: In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: August 13, 2002
    Assignee: Eupec Europaeische Gesellschaft fuer Leistungshalbleiter MbH & Co. KG
    Inventors: Horst Hellbrück, Ralf Jörke, Konstantin Kanelis, Manfred Loddenkötter, Thilo Stolze
  • Spring clip for fixing semiconductor modules to a heat sink
    Publication number: 20010030037
    Abstract: In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.
    Type: Application
    Filed: February 26, 2001
    Publication date: October 18, 2001
    Inventors: Horst Hellbruck, Ralf Jorke, Konstantin Kanelis, Manfred Loddenkotter, Thilo Stolze