Abstract: The invention relates to heat-curing and light-fixable epoxy-based compositions which are liquid at room temperature, comprising at least one epoxy-containing compound (A) having at least two epoxy groups, at least one curing agent (B) for the epoxy-containing compound, optionally an accelerator (C), at least one radiation-curing compound (D), at least one photoinitiator (E) for radical polymerization and at least one filler (F). The radiation-curing compound (D) comprises at least one at least trifunctional (meth)acrylate. In particular, the epoxy composition can be used for fixing and/or selectively encapsulating electrical, electronic and/or electromechanical components, and/or for bonding, coating and sealing.