Abstract: The present disclosure relates to a device and to a method for imaging an object in at least two views. The device and the method can be used, for example, for teaching-in or monitoring a robot or for monitoring handling systems or, more generally, with devices which require imaging of an object for an analysis or a monitoring process. The device allows an object to be imaged in at least two different views simultaneously, comprising at least one imaging optical element and at least one reflective element, wherein the reflective element is at least partly arranged within object space of the imaging optical element, optical axis of the imaging optical element being associated with first view of the object, and wherein the reflective element is operable to image a second view of the object, which is different from the first view.

Abstract: In order to improve the detectability of defects in structures incorporated beneath the surface of a wafer, it is suggested to acquire an IR subimage of the illuminated wafer with an IR image acquisition device and a VIS subimage with a VIS image acquisition device. The acquisition is performed simultaneously and is controlled such that the same area of the wafer is imaged sharply by both image acquisition devices. An image processor is used to determine whether a detected defect is attributable to a defect on the surface or to a defect of the structures located beneath the surface.