Patents by Inventor Ralf Linkmann

Ralf Linkmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-speed RFID circuit placement method and device
    Patent number: 8531297
    Abstract: A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: September 10, 2013
    Assignee: Avery Dennison Corporation
    Inventors: Scott Wayne Ferguson, Ralf Linkmann, Werner Kiehne
  • HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE
    Publication number: 20100043203
    Abstract: A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.
    Type: Application
    Filed: October 28, 2009
    Publication date: February 25, 2010
    Applicant: AVERY DENNISON CORPORATION
    Inventors: Scott Wayne FERGUSON, Ralf LINKMANN, Werner KIEHNE
  • High-speed RFID circuit placement method and device
    Patent number: 7623034
    Abstract: A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: November 24, 2009
    Assignee: Avery Dennison Corporation
    Inventors: Scott Wayne Ferguson, Ralf Linkmann, Werner Kiehne
  • High-speed RFID circuit placement method and device
    Publication number: 20060238345
    Abstract: A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.
    Type: Application
    Filed: June 9, 2005
    Publication date: October 26, 2006
    Inventors: Scott Ferguson, Ralf Linkmann, Werner Kiehne