Abstract: A composition comprises the reaction product of a dithiophosphate derivative and an amine. The reaction product is present in the composition in an amount of at least about 25 wt. %. The composition may include additional components. A method of forming the composition comprises the step of combining the dithiophosphate derivative and the amine to form the composition. A method of increasing thermal stability of a dithiophosphate derivative comprises the step of combining the dithiophosphate derivative and an amine. The dithiophosphate derivative can decompose to form hydrogen sulfide (H2S). However, the amine substantially prevents thermal decomposition of the dithiophosphate derivative. An example of the dithiophosphate derivative is 3-(di-isobutoxy-thiophosphorylsulfanyl)-2-methyl-propanoic acid. An example of the amine is ditridecyl amine. The composition can be used for a variety of applications.

Abstract: A composition comprises the reaction product of a dithiophosphate derivative and an amine. The reaction product is present in the composition in an amount of at least about 25 wt. %. The composition may include additional components. A method of forming the composition comprises the step of combining the dithiophosphate derivative and the amine to form the composition. A method of increasing thermal stability of a dithiophosphate derivative comprises the step of combining the dithiophosphate derivative and an amine. The dithiophosphate derivative can decompose to form hydrogen sulfide (H2S). However, the amine substantially prevents thermal decomposition of the dithiophosphate derivative. An example of the dithiophosphate derivative is 3-(di-isobutoxy-thiophosphorylsulfanyl)-2-methyl-propanoic acid. An example of the amine is ditridecyl amine. The composition can be used for a variety of applications.

Abstract: A composition comprises the reaction product of a dithiophosphate derivative and an amine. The reaction product is present in the composition in an amount of at least about 25 wt. %. The composition may include additional components. A method of forming the composition comprises the step of combining the dithiophosphate derivative and the amine to form the composition. A method of increasing thermal stability of a dithiophosphate derivative comprises the step of combining the dithiophosphate derivative and an amine. The dithiophosphate derivative can decompose to form hydrogen sulfide (H2S). However, the amine substantially prevents thermal decomposition of the dithiophosphate derivative. An example of the dithiophosphate derivative is 3-(di-isobutoxy-thiophosphorylsulfanyl)-2-methyl-propanoic acid. An example of the amine is ditridecyl amine. The composition can be used for a variety of applications.

Abstract: A composition comprises the reaction product of a dithiophosphate derivative and an amine. The reaction product is present in the composition in an amount of at least about 25 wt. %. The composition may include additional components. A method of forming the composition comprises the step of combining the dithiophosphate derivative and the amine to form the composition. A method of increasing thermal stability of a dithiophosphate derivative comprises the step of combining the dithiophosphate derivative and an amine. The dithiophosphate derivative can decompose to form hydrogen sulfide (H2S). However, the amine substantially prevents thermal decomposition of the dithiophosphate derivative. An example of the dithiophosphate derivative is 3-(di-isobutoxy-thiophosphorylsulfanyl)-2-methyl-propanoic acid. An example of the amine is ditridecyl amine. The composition can be used for a variety of applications.

Abstract: The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled.

Abstract: The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled.