Abstract: In an apparatus for mounting workpieces or substrates for transport between a receiving or issuing station and a coating station in the interior of a vacuum coating chamber and for the control of the temperature of the workpieces during cathode sputtering, the workpiece carrier is in the form of a hollow body partially filled with a heat transfer medium. On the side of the workpiece carrier facing the coating source there is provided a workpiece socket in the form of an oval channel in which workpieces such as bearing shells can be placed. Parallel to the longitudinal edges of the groove-like workpiece socket, edge strips of gripping jaws are disposed, which hold the workpieces in the workpiece socket. The workpiece carrier is furthermore provided with a heat transfer head against which cooling plates or bodies can be pressed, which are connected by flexible pressure hoses to a cooling circuit.