Abstract: An optical system for a microlithographic projection exposure apparatus and a microlithographic exposure method are disclosed. In an embodiment an optical system for a microlithographic projection exposure apparatus includes at least one mirror arrangement having a plurality of mirror elements which are displaceable independently of each other for altering an angular distribution of the light reflected by the mirror arrangement. The optical system also includes at least one manipulator downstream of the mirror arrangement in the light propagation direction. The manipulator has a raster arrangement of manipulator elements so that light incident on the manipulator during operation of the optical system is influenced differently in its polarization state and/or in its intensity in dependence on the incidence location.

Abstract: Illumination systems for microlithographic projection exposure apparatus, as well as related systems, components and methods are disclosed. In some embodiments, an illumination system includes one or more scattering structures and an optical integrator that produces a plurality of secondary light sources.

Abstract: Illumination systems for microlithographic projection exposure apparatus, as well as related systems, components and methods are disclosed. In some embodiments, an illumination system includes one or more scattering structures and an optical integrator that produces a plurality of secondary light sources.

Abstract: Illumination systems for microlithographic projection exposure apparatus, as well as related systems, components and methods are disclosed. In some embodiments, an illumination system includes one or more scattering structures and an optical integrator that produces a plurality of secondary light sources.

Abstract: In a method for multiply exposing at least one substrate coated with a photosensitive layer, a first exposure is carried out in accordance with a first set of exposure parameters on a first projection system (17), and a second exposure is carried out in accordance with a second set of exposure parameters on a second projection system (18) spatially separated from the first projection system (17). The projection systems are integrated in a common projection exposure installation (1). The first exposure can be carried out, for example, with an amplitude mask (6), the second exposure with a phase mask (9). The use of a number of projection systems enables multiple exposure that is performed in parallel and is therefore timesaving.

Abstract: Illumination optics for EUV microlithography guide an illumination light bundle from a radiation source to an object field with an extension ratio between a longer field dimension and a shorter field dimension, where the ratio is considerably greater than 1.

Abstract: The disclosure relates to an optical integrator configured to produce a plurality of secondary light sources in an illumination system of a microlithographic projection exposure apparatus. The disclosure also relates to a method of manufacturing an array of elongated microlenses for use in such an illumination system. Arrays of elongated microlenses are often contained in optical integrators or scattering plates of such illumination systems.

Abstract: Illumination systems for microlithographic projection exposure apparatus, as well as related systems, components and methods are disclosed. In some embodiments, an illumination system includes one or more scattering structures and an optical integrator that produces a plurality of secondary light sources.

Abstract: Illumination systems for microlithographic projection exposure apparatus, as well as related systems, components and methods are disclosed. In some embodiments, an illumination system includes one or more scattering structures and an optical integrator that produces a plurality of secondary light sources.

Abstract: The disclosure relates to an optical integrator configured to produce a plurality of secondary light sources in an illumination system of a microlithographic projection exposure apparatus. The disclosure also relates to a method of manufacturing an array of elongated microlenses for use in such an illumination system. Arrays of elongated microlenses are often contained in optical integrators or scattering plates of such illumination systems.

Abstract: An illumination optics for EUV microlithography guides an illumination light bundle from a radiation source to an object field with an extension ratio between a longer field dimension and a shorter field dimension, where the ratio is considerably greater than 1. A field facet mirror has a plurality of field facets that set defined illumination conditions in the object field. A following optics downstream of the field facet mirror transmits the illumination light into the object field. The following optics includes a pupil facet mirror with a plurality of pupil facets. The field facets are in each case individually allocated to the pupil facets so that portions of the illumination light bundle impinging upon in each case one of the field facets are guided on to the object field via the associated pupil facet.

Abstract: The disclosure relates to an optical integrator configured to produce a plurality of secondary light sources in an illumination system of a microlithographic projection exposure apparatus. The disclosure also relates to a method of manufacturing an array of elongated microlenses for use in such an illumination system. Arrays of elongated microlenses are often contained in optical integrators or scattering plates of such illumination systems.

Abstract: In a method for multiply exposing at least one substrate coated with a photosensitive layer, a first exposure is carried out in accordance with a first set of exposure parameters on a first projection system, and a second exposure is carried out in accordance with a second set of exposure parameters on a second projection system spatially separated from the first projection system. The projection systems are integrated in a common projection exposure installation. The first exposure can be carried out, for example, with an amplitude mask, the second exposure with a phase mask. The use of a number of projection systems enables multiple exposure that is performed in parallel and is therefore timesaving.

Abstract: In a method for multiply exposing at least one substrate coated with a photosensitive layer, a first exposure is carried out in accordance with a first set of exposure parameters on a first projection system (17), and a second exposure is carried out in accordance with a second set of exposure parameters on a second projection system (18) spatially separated from the first projection system (17). The projection systems are integrated in a common projection exposure installation (1). The first exposure can be carried out, for example, with an amplitude mask (6), the second exposure with a phase mask (9). The use of a number of projection systems enables multiple exposure that is performed in parallel and is therefore timesaving.

Abstract: In a method for multiply exposing at least one substrate coated with a photosensitive layer, a first exposure is carried out in accordance with a first set of exposure parameters on a first projection system (17), and a second exposure is carried out in accordance with a second set of exposure parameters on a second projection system (18) spatially separated from the first projection system (17). The projection systems are integrated in a common projection exposure installation (1). The first exposure can be carried out, for example, with an amplitude mask (6), the second exposure with a phase mask (9). The use of a number of projection systems enables multiple exposure that is performed in parallel and is therefore timesaving.

Abstract: The disclosure relates to an optical integrator configured to produce a plurality of secondary light sources in an illumination system of a microlithographic projection exposure apparatus. The disclosure also relates to a method of manufacturing an array of elongated microlenses for use in such an illumination system. Arrays of elongated microlenses are often contained in optical integrators or scattering plates of such illumination systems.

Abstract: Illumination systems for microlithographic projection exposure apparatus, as well as related systems, components and methods are disclosed. In some embodiments, an illumination system includes one or more scattering structures and an optical integrator that produces a plurality of secondary light sources.

Abstract: In a method for multiply exposing at least one substrate coated with a photosensitive layer, a first exposure is carried out in accordance with a first set of exposure parameters on a first projection system, and a second exposure is carried out in accordance with a second set of exposure parameters on a second projection system spatially separated from the first projection system. The projection systems are integrated in a common projection exposure installation. The first exposure can be carried out, for example, with an amplitude mask, the second exposure with a phase mask. The use of a number of projection systems enables multiple exposure that is performed in parallel and is therefore timesaving.

Abstract: An illumination system for a microlithographic projection exposure apparatus has a first polarization manipulator, a second polarization manipulator and at least one optical element located between these manipulators. The polarization manipulators ensure that the direction of the electric field vector of a light ray varies in time between the polarization manipulators, whereas the polarization state is fixed outside the polarization manipulators. This prevents high energy light from inducing birefringence in optical elements arranged between the two polarization manipulators.

Abstract: In a method for multiply exposing at least one substrate coated with a photosensitive layer, a first exposure is carried out in accordance with a first set of exposure parameters on a first projection system (17), and a second exposure is carried out in accordance with a second set of exposure parameters on a second projection system (18) spatially separated from the first projection system (17). The projection systems are integrated in a common projection exposure installation (1). The first exposure can be carried out, for example, with an amplitude mask (6), the second exposure with a phase mask (9). The use of a number of projection systems enables multiple exposure that is performed in parallel and is therefore timesaving.