Patents by Inventor Ralf Stanzmann

Ralf Stanzmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11452214
    Abstract: A printed circuit board is provided with multiple electrically conductive layers which are separated from each other by electrically non-conductive layers. At least one electrically conductive outer layer and multiple electrically conductive intermediate layers are provided. At least one electrically conductive through-connection is provided between an electrically conductive outer layer and an electrically conductive intermediate layer. The printed circuit board consists of at least one first multilayer PCB and one second multilayer PCB. The first multilayer PCB is formed from multiple electrically conductive layers and multiple electrically non-conductive layers, and the second multilayer PCB has at least one electrically conductive layer and at least one electrically non-conductive layer. The multilayer PCBs are connected to each other.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: September 20, 2022
    Assignee: Hella GmbH & Co. KGaA
    Inventor: Ralf Stanzmann
  • Publication number: 20190254175
    Abstract: A printed circuit board is provided with multiple electrically conductive layers which are separated from each other by electrically non-conductive layers. At least one electrically conductive outer layer and multiple electrically conductive intermediate layers are provided. At least one electrically conductive through-connection is provided between an electrically conductive outer layer and an electrically conductive intermediate layer. The printed circuit board consists of at least one first multi layer PCB and one second multilayer PCB. The first multilayer PCB is formed from multiple electrically conductive layers and multiple electrically non-conductive layers, and the second multilayer PCB has at least one electrically conductive layer and at least one electrically non-conductive layer. The multilayer PCBs are connected to each other.
    Type: Application
    Filed: October 13, 2017
    Publication date: August 15, 2019
    Inventor: Ralf Stanzmann