Abstract: An illumination optics for microlithography includes an optical assembly for guiding illumination light to an object field to be illuminated in an object plane. The illumination optics can divide an illumination light radiation bundle into a plurality of radiation sub-bundles which are assigned to different illumination angles of the object field illumination. The illumination optics is configured so that at least some of the radiation sub-bundles are superimposed in a superposition plane which is spaced from the object plane and which is not imaged into the object plane in which superposition takes place. This superposition is such that edges of the superimposed radiation sub-bundles coincide at least partially. In some embodiments, a field intensity setting device includes a plurality of adjacent individual diaphragms which at least attenuate illumination light when exposed thereon.

Abstract: In general, in one aspect, the invention features a system that includes an illumination system of a microlithography tool, the illumination system including a first component having a plurality of elements. During operation of the system, the elements direct radiation from a source along an optical path to an arc-shaped object field at an object plane of a projection objective, and at least one of the elements has a curved shape that is different from the arc-shape of the object field.

Abstract: A projection exposure apparatus for microlithography has an illumination system with an EUV light source and an illumination optical unit to expose an object field in an object plane. A projection optical unit images the object field into an image field in an image plane. A pupil facet mirror in a plane of the illumination optical unit that coincides with a pupil plane of the projection optical unit or that is optically conjugate with respect thereto has a plurality of individual facets on which illumination light can impinge. A correction diaphragm is in or adjacent to a pupil plane of the projection optical unit or in a conjugate plane with respect thereto. The correction diaphragm screens the illumination of the entrance pupil of the projection optical unit so that at least some source images assigned to the individual facets of the pupil facet mirror in the entrance pupil of the projection optical unit are partly shaded by one and the same diaphragm edge.

Abstract: The disclosure relates to illumination optical systems for microlithography, such as EUV-microlithography, as well as related systems, components and methods.

Abstract: An adjusting device used to align two components of a microlithography projection exposure installation relative to each other. The adjusting device has an autocollimating device with a light source and a reflector. The light source and the reflector are each rigidly connected to one of the optical components. In one embodiment, the adjusting device has a laser light source which is different from the radiation source. A beam-splitter is downstream from the laser light source and carries useful adjustment light along a first optical path. A reflector can be rigidly connected to a reference component of an illuminating optics system or to a radiation source so that when an actual position of the reference component relative to the radiation source coincides with a desired position, the useful adjustment light is reflected back on itself. A bundle-sensitive component is sensitive to the direction and position of useful adjustment light in the optical path between bundle-sensitive component and reflector.

Abstract: A projection exposure apparatus for microlithography is disclosed. The apparatus can include a radiation source to generate illumination radiation and a reticle holder to receive a reticle in an object plane. The apparatus can further include illumination optics to guide the illumination radiation to an object field, which is to be illuminated, in the object plane. The apparatus can also include a wafer holder to receive a wafer in an image plane and projection optics to image the object field into an image field in the image plane. The radiation source and projection optics can be arranged in separate chambers (e.g., one above the other). The chambers can be separated by a wall. There can be an illumination radiation leadthrough in the wall. In some embodiments, the projection exposure apparatus can guide the illumination radiation with low loss.

Abstract: Collectors with mirror shells arranged inside each other, illumination systems equipped with such collectors, projection exposure apparatuses equipped with such illumination systems, methods of manufacturing microelectronic components with such projection exposure apparatuses, and related systems, components and methods are disclosed.