Abstract: An arrangement of a microlithographic optical imaging device includes first and supporting structures. The first supporting structure supports an optical element of the imaging device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another between the first and second supporting structures. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device configured to measure the position and/or orientation of the optical element in relation to a reference in at least one degree of freedom and up to all six degrees of freedom in space. A creep compensation device compensates a change in a static relative situation between the first and second supporting structures in at least one correction degree of freedom.

Abstract: An arrangement of a microlithographic optical imaging device includes first and second supporting structures. The first supporting structure supports an optical element of the imaging device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another between the first and second supporting structures. Each of the supporting spring devices defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device which measures the position and/or orientation of the at least one optical element in relation to a reference in at least one degree of freedom up to all six degrees of freedom in space. A reduction device reduces a change in a static relative situation between the first and second supporting structures in at least one correction degree of freedom.

Abstract: An arrangement of a microlithographic optical imaging device includes first and second supporting structures. The first supporting structure supports at least one optical element of the imaging device via an active relative situation control device of a control device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device of the control device. The measuring device is connected to the relative situation control device. The measuring device outputs to the relative situation control device measurement information representative for the position and/or the orientation of the at least one optical element in relation to a reference in at least one degree of freedom in space.

Abstract: A stop, such as a numerical aperture stop, obscuration stop or false-light stop, for a lithography apparatus, includes a light-transmissive aperture and a stop element, in which or at which the aperture is provided. The stop element is opaque and fluid-permeable outside the aperture.

Abstract: An arrangement of a microlithographic optical imaging device includes first and supporting structures. The first supporting structure supports an optical element of the imaging device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another between the first and second supporting structures. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device configured to measure the position and/or orientation of the optical element in relation to a reference in at least one degree of freedom and up to all six degrees of freedom in space. A creep compensation device compensates a change in a static relative situation between the first and second supporting structures in at least one correction degree of freedom.

Abstract: An arrangement of a microlithographic optical imaging device includes first and second supporting structures. The first supporting structure supports at least one optical element of the imaging device via an active relative situation control device of a control device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device of the control device. The measuring device is connected to the relative situation control device. The measuring device outputs to the relative situation control device measurement information representative for the position and/or the orientation of the at least one optical element in relation to a reference in at least one degree of freedom in space.

Abstract: An arrangement of a microlithographic optical imaging device includes first and second supporting structures. The first supporting structure supports an optical element of the imaging device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another between the first and second supporting structures. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device which is configured to measure the position and/or orientation of the at least one optical element in relation to a reference in at least one degree of freedom. A creep compensation device compensates a creep-induced change in a static relative situation between the first and second supporting structures in at least one correction degree of freedom.

Abstract: An arrangement of a microlithographic optical imaging device includes first and second supporting structures. The first supporting structure supports an optical element of the imaging device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another between the first and second supporting structures. Each of the supporting spring devices defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device which measures the position and/or orientation of the at least one optical element in relation to a reference in at least one degree of freedom up to all six degrees of freedom in space. A reduction device reduces a change in a static relative situation between the first and second supporting structures in at least one correction degree of freedom.

Abstract: A projection exposure apparatus for semiconductor lithography includes a component and fixed to a structural part of the apparatus. The component and/or the structural part have/has a stop for bearing against a reference surface at the structural part and/or the component. The stop is movable relative to the component fixed and/or the structural part so that it can be moved away from the reference surface. A method for adjusting a component on a structural part of a projection exposure apparatus includes: securing a stop to the component or the structural part; positioning the component so that the stop comes into mechanical contact with a reference surface at the component or the structural part; fixing the component to the structural part; and moving the stop away from the reference surface.

Abstract: A projection exposure apparatus for semiconductor lithography includes a component and fixed to a structural part of the apparatus. The component and/or the structural part have/has a stop for bearing against a reference surface at the structural part and/or the component. The stop is movable relative to the component fixed and/or the structural part so that it can be moved away from the reference surface. A method for adjusting a component on a structural part of a projection exposure apparatus includes: securing a stop to the component or the structural part; positioning the component so that the stop comes into mechanical contact with a reference surface at the component or the structural part; fixing the component to the structural part; and moving the stop away from the reference surface.

Abstract: An optical arrangement, in particular a lithography system, includes: a movable component, in particular a mirror; at least one actuator for moving the component; and at least one stop having a stop face for delimiting the movement of the component. The optical arrangement further includes, on a stop or on a plurality of stops, at least two stop faces for delimiting the movement of the movable component in one and the same movement direction.

Abstract: An optical arrangement, for example a lithography system, includes: a first component, in particular a carrying frame; a second component, in particular a mirror, which is movable in relation to the first component; and at least one stop with at least one stop face for limiting the movement of the second component in relation to the first component. The optical arrangement, preferably the stop, can have a fixing device for fixing the second component. The fixing device can have a fixing element that is movable in relation to the stop face of the stop. Further aspects of the device likewise relate to an optical arrangement with a fixing device or with a transport lock.

Abstract: An optical arrangement, for example a lithography system, includes: a first component, in particular a carrying frame; a second component, in particular a mirror, which is movable in relation to the first component; and at least one stop with at least one stop face for limiting the movement of the second component in relation to the first component. The optical arrangement, preferably the stop, can have a fixing device for fixing the second component. The fixing device can have a fixing element that is movable in relation to the stop face of the stop. Further aspects of the device likewise relate to an optical arrangement with a fixing device or with a transport lock.

Abstract: An optical arrangement, in particular a lithography system, includes: a movable component, in particular a mirror; at least one actuator for moving the component; and at least one stop having a stop face for delimiting the movement of the component. The optical arrangement further includes, on a stop or on a plurality of stops, at least two stop faces for delimiting the movement of the movable component in one and the same movement direction.

Abstract: The disclosure relates to an optical device for a lithography system, including an optical element, a supporting frame supporting the optical element, a sensor frame mechanically decoupled from the supporting frame, wherein a gap is provided between the supporting frame and the sensor frame, and a sensor assembly designed to determine a width of the gap in a contactless manner. The sensor assembly has a contact element and a contact surface. The contact element is designed to contact the contact surface to limit relative motion of the supporting frame relative to the sensor frame.

Abstract: The disclosure relates to an optical device for a lithography system, including an optical element, a supporting frame supporting the optical element, a sensor frame mechanically decoupled from the supporting frame, wherein a gap is provided between the supporting frame and the sensor frame, and a sensor assembly designed to determine a width of the gap in a contactless manner. The sensor assembly has a contact element and a contact surface. The contact element is designed to contact the contact surface to limit relative motion of the supporting frame relative to the sensor frame.