Patents by Inventor Ralph A. Barrese
Ralph A. Barrese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7425256Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: GrantFiled: September 14, 2007Date of Patent: September 16, 2008Assignee: International Business Machines CorporationInventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
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Publication number: 20080000777Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: ApplicationFiled: September 14, 2007Publication date: January 3, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Ralph Barrese, Gary Gajdorus, Allen Hopkins, John Konrad, Robert Schaffer, Timothy Wells
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Patent number: 7288177Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: GrantFiled: March 30, 2004Date of Patent: October 30, 2007Assignee: International Business Machines CorporationInventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
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Publication number: 20050218002Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: ApplicationFiled: March 30, 2004Publication date: October 6, 2005Applicant: International Business Machines CorporationInventors: Ralph Barrese, Gary Gajdorus, Allen Hopkins, John Konrad, Robert Schaffer, Timothy Wells
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Patent number: 6746578Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: GrantFiled: May 31, 2001Date of Patent: June 8, 2004Assignee: International Business Machines CorporationInventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
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Publication number: 20020179450Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.Type: ApplicationFiled: May 31, 2001Publication date: December 5, 2002Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
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Patent number: 6372101Abstract: An apparatus for preventing drag-out is provided. The apparatus is arranged at an exit where a workpiece leaves a plating chamber. Brush members are arranged to contact both sides of the workpiece as it leaves the plating chamber. The brush members are adjustably arranged in a housing such that the angle of the brush member relative to the workpiece can be varied. A locking mechanism is provided to hold the brush member at a selected angle. The entire apparatus is adjustably inward and outward with respect to the workpiece as well as with respect to the plating chamber.Type: GrantFiled: September 8, 1999Date of Patent: April 16, 2002Assignee: International Business Machines CorporationInventors: Ralph A. Barrese, Allen H. Hopkins, John J. Konrad, Donald L. Putman, David A. Space, Jr.