Abstract: A hot-stamping device (1) is described, having a stamping device (2) for transferring a transfer layer (15u) disposed on a carrier layer (15t) of a hot-stamping foil (15) on to a substrate (14). The hot-stamping device comprises a heatable stamping roller (11) and a counter-pressure roller (12), between which a stamping gap (16) is realized, and comprising a separating device (3), disposed downstream, for separating the carrier layer (15t) from the transfer layer (15u) transferred on to the substrate (14). A flat support element (18) is disposed under the stamped substrate (17), between the stamping gap (16) and the separating device (3), directly adjoining the stamping gap (16) or at a distance of <1 mm from the stamping gap (16) or overlapping the stamping gap (16).

Abstract: A hot-stamping device (1) is described, having a stamping device (2) for transferring a transfer layer (15u) disposed on a carrier layer (15t) of a hot-stamping foil (15) on to a substrate (14). The hot-stamping device comprises a heatable stamping roller (11) and a counter-pressure roller (12), between which a stamping gap (16) is realized, and comprising a separating device (3), disposed downstream, for separating the carrier layer (15t) from the transfer layer (15u) transferred on to the substrate (14). A flat support element (18) is disposed under the stamped substrate (17), between the stamping gap (16) and the separating device (3), directly adjoining the stamping gap (16) or at a distance of <1 mm from the stamping gap (16) or overlapping the stamping gap (16).