Abstract: The invention comprises a micromechanical shock sensor that is formed on the surface of a micro-substrate. A moveable proof mass is formed on the surface with at least one spring connected to the proof mass and the surface. The spring allows the proof mass to move a predetermined distance. Latching means are formed on the surface the predetermined distance from the proof mass. When the sensor is subjected to a sufficient shock, the proof mass moves and contacts the latching means. An indicator means is provided to allow this contact to be readily known by the user.

Abstract: An improved hydrostat constructed on a silicon wafer by microfabrication methods similar to those used for integrated circuits and other devices. A thin section of the wafer acts as a diaphragm, responsive to pressure of ambient water. A lever arm is affixed at its first end to one point on the surface of the wafer and extends over the diaphragm, so arranged that the lever arm will be forced away from the wafer when pressure is applied to the diaphragm. The second end of the lever arm is moved by the diaphragm so that it moves further from the wafer, by a factor of the mechanical advantage of the lever. When the second end moves away from the wafer, it mechanically releases a lock, allowing an ordnance device to which the hydrostat is attached to arm.