Abstract: The present invention includes a process using environmentally friendly materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The process uses a novel adhesive remover composition comprising one or more non-halogenated organic solvents, a non-abrasive thickening agent, a surfactant, and a vapor-pressure modulating agent. The total Hansen Solubility Parameter (?t) at 25° C. for each of the non-halogenated organic solvents is from about 14 MPa1/2 to about 24 MPa1/2. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: The present invention includes a process using environmentally friendly materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The process uses a novel adhesive remover composition comprising one or more non-halogenated organic solvents, a non-abrasive thickening agent, a surfactant, and a vapor-pressure modulating agent. The total Hansen Solubility Parameter (?t) at 25° C. for each of the non-halogenated organic solvents is from about 14 MPa1/2 to about 24 MPa1/2. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: The present invention includes a process using environmentally friendly materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The process uses a novel adhesive remover composition comprising one or more non-halogenated organic solvents, a non-abrasive thickening agent, a surfactant, and a vapor-pressure modulating agent. The total Hansen Solubility Parameter (?t) at 25° C. for each of the non-halogenated organic solvents is from about 14 MPa1/2 to about 24 MPa1/2. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: A pre-fabricated article for a composite aircraft component includes a dielectric layer and a pre-fabricated metalized pattern on the dielectric layer. The metalized pattern is fabricated on the dielectric layer prior to integration with the composite aircraft component. The metalized pattern diverts EME current away from EME protection areas of the aircraft component.

Abstract: An aircraft component includes a composite structure and a metallic circuit on a film. The film is co-cured with the composite structure. The metallic circuit is patterned to dissipate energy generated by lightning strikes on the composite structure. The metal circuit is also patterned to provide connectivity for multi-function apparatus.

Abstract: An exemplary embodiment provides a multi-layer circuit joining assembly material configured to repair multi-layer flex circuits deployed on or in a composite surface as a lightning protection system. The multi-layer circuit joining assembly material includes a first conductive layer having a first end portion, a second conductive layer having a second end portion, and a dielectric material between the first conductive layer and the second conductive layer.

Abstract: The present invention includes a process using environmentally benign materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The invention uses an absorbable indicator (tracer) dye to aid in detection of remaining residues that may be in need of additional cleaning. The process uses a novel adhesive remover composition comprising a non-halogenated organic solvent, a non-abrasive thickening agent, a surfactant, glycerine, and an absorbable indicator dye. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: An exemplary embodiment provides a multi-layer circuit joining assembly material configured to repair multi-layer flex circuits deployed on or in a composite surface as a lightning protection system. The multi-layer circuit joining assembly material includes a first conductive layer having a first end portion, a second conductive layer having a second end portion, and a dielectric material between the first conductive layer and the second conductive layer.

Abstract: An exemplary embodiment provides a composite substrate including a resin matrix that has embedded therein a flex circuit and reinforcing filler. The flex circuit includes a metallic circuit on a film that is co-cured with the resin matrix. The metallic circuit may be configured for any of a variety of functions, including for example, dissipating energy generated by a lightning strike on the composite substrate. The flex circuit may also provide a platform for implementation of other communication and maintenance functions.

Abstract: A pre-fabricated article for a composite aircraft component includes a dielectric layer and a pre-fabricated metalized pattern on the dielectric layer. The metalized pattern is fabricated on the dielectric layer prior to integration with the composite aircraft component. The metalized pattern diverts EME current away from EME protection areas of the aircraft component.

Abstract: The present invention includes a process using environmentally benign materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The invention uses an absorbable indicator (tracer) dye to aid in detection of remaining residues that may be in need of additional cleaning. The process uses a novel adhesive remover composition comprising a non-halogenated organic solvent, a non-abrasive thickening agent, a surfactant, glycerine, and an absorbable indicator dye. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: The present invention includes a process using environmentally friendly materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The process uses a novel adhesive remover composition comprising one or more non-halogenated organic solvents, a non-abrasive thickening agent, a surfactant, and a vapor-pressure modulating agent. The total Hansen Solubility Parameter (?t) at 25° C. for each of the non-halogenated organic solvents is from about 14 MPa1/2 to about 24 MPa1/2. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: A probe that is used to determine the etch rate of a nonconductive material is comprised of a substrate of the material itself, plated on opposite sides with a conductive material. A first side of the probe has a small area of the plating removed to expose the substrate. The other side has an annular portion of the plating removed to define a wafer of plating isolated from the remainder of the plating. A lead wire is connected to the wafer and the entire second side of the probe is coated with an insulating mask. The probe is immersed in a bath of the etching solution. A voltage source is connected to the probe and to an electrode also immersed in the bath. A measurement device is connected in the circuit to detect current flow. When the etching bath dissolves the substrate through the exposed portion, a circuit is completed with the lead wire and the current flow is detected. The time from immersion of the probe to the beginning of current flow is used to calculate etch rate.