Abstract: A multi-layer printed circuit board (21) has through holes (15-17) which are plated without conventional pads. This avoids circuit board rejections which would occur from cosmetic defects resulting from incomplete solder coverage of the pads and from pad lifting. In order to provide the through holes (15-17) with an adequate supply of solder during solder operations, wicks (45) are provided for each through hole (15-16) which is isolated from circuit traces (37, 38) on the exterior surface (33) of the printed circuit board (21). If the through hole (17) is connected to a circuit trace (38) on the exterior surface (33), then a connecting run (48) is used to provide wicking action in lieu of a tab (45).

Abstract: A multilayer printed circuit board (10) is provided with vertical circuit traces (51-54) which are readily accessible by mechanical means, by first creating vias at the locations of the vertical circuit traces (51-54). An opening (59) is then bored in a manner that the perimeter of the opening (59) intercepts the vias. The remaining plating material on the vias forms the vertical circuit traces (51-54), which are thereby established along the perimeter of the opening (59).This technique utilizes procedures which are readily adaptable to present multilayer printed circuit board manufacturing techniques and which effect a low cost and reliable connection. Furthermore, the vertical circuit traces (51-54) are readily accessible for mechanical broaching and can be formed in a relatively high-density configuration.