Abstract: An improved conduction cooling system for a semiconductor package that includes a slidable conduction cooling piston in contact with a device and mounted in a cap or cold plate, a means for urging the piston longitudinally and laterally into contact with the device and the cap or cold plate, respectively, and a means to prevent rotation of the piston.

Abstract: An improved electronic package having a support substrate, at least one electronic device mounted on the substrate, a cover mounted on the substrate disposed over said device and having a surface in spaced proximity to the device, the improvement being:a thermal bridge for conducting heat from the device to the cover which includes a relatively thick metal sheet provided with cuts that define at least one tab element,grooves in the tab element that make it bendable,and a spring means to selectively urge the tab element into contact with the device.

Abstract: A conduction heat transfer connection is made between a heat source and a heat sink which is flexible so as to adapt to variations in distance between the source and sink and which maintains the required force on the heat source to obtain the required heat transfer across the junction therebetween. The connection consists of a heat conductive metallic foil bundle of sufficient thickness to contact sufficient surface area of the heat source to provide the required heat transfer and of sufficient thinness to be flexible enough to absorb the expansion and contraction due to temperature changes as well as the differences in distance between the heat source and sink and of sufficient length to contact at or near the other end thereof the heat sink.