Patents by Inventor Ralph E. Parsons

Ralph E. Parsons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
    Patent number: 4948707
    Abstract: A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.
    Type: Grant
    Filed: February 16, 1988
    Date of Patent: August 14, 1990
    Assignee: International Business Machines Corporation
    Inventors: Robert W. Johnson, William H. Lawrence, Gary K. Lemon, Roy H. Magnuson, Voya R. Markovich, Ralph E. Parsons, Carlos J. Sambucetti
  • Electroless copper plating bath and improved stability
    Patent number: 4655833
    Abstract: An electroless copper plating bath having improved stability which contains a cationic polymer from acrylamide and/or methacrylamide. The plating bath also contains a cupric ion source, a reducing agent for the cupric ion source, and a complexing agent for the cupric ion.
    Type: Grant
    Filed: October 9, 1985
    Date of Patent: April 7, 1987
    Assignee: International Business Machines Corporation
    Inventors: William J. Amelio, Peter G. Bartolotta, Voya Markovich, Ralph E. Parsons