Patents by Inventor Ralph E. Rippere

Ralph E. Rippere has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4518661
    Abstract: Electrically conductive bodies and methods of using same are disclosed which generally incorporate the feature of wire crossing wire at multiple sites of mutual contact throughout the body with the wire interconnected at the sites by a chemical deposition of metal to yield a rigid, open metallic lattice.
    Type: Grant
    Filed: September 28, 1982
    Date of Patent: May 21, 1985
    Inventor: Ralph E. Rippere
  • Patent number: 4290195
    Abstract: Composition material, preferably comprising solder-coated copper particles, is loaded into a defined space which preferably comprises a hole drilled into a circuit board to expose a surface of at least one internal conductor. The loaded composition material is then compacted within the space and thereafter heated to melt only the coating sufficiently to allow at least a portion of the coating to flow onto the exposed surface of the conductor. Upon cooling, the composition material forms a compact which establishes a rigid electrical and mechanical connection between the conductor and the compact. Preferably, the compact may thereafter be drilled and component leads of an electrical device soldered or otherwise connected to the compact.
    Type: Grant
    Filed: September 1, 1978
    Date of Patent: September 22, 1981
    Inventor: Ralph E. Rippere
  • Patent number: 4120758
    Abstract: Methods for producing alloy metal powders by electrodeposition are disclosed. Compositions comprising a core surrounded by at least one discrete, substantially laminar layer of a metal different from the core are formed by electro-depositing the different metal onto a core metal powder cathode. The electro-deposition may be repeated to provide successive laminar layers of different metals. By the methods disclosed herein alloy powders of controlled composition may be readily generated. Among the advantages of these processes are increased rate of subsequent sintering and decreased loss of the core metal through oxidation or evaporation.
    Type: Grant
    Filed: July 14, 1977
    Date of Patent: October 17, 1978
    Inventor: Ralph E. Rippere
  • Patent number: 4046643
    Abstract: Methods for integrating alloy components into individual powder metallurgy particles, as opposed to the conventional side-by-side mixture of the separate powder particles of each individual component, are disclosed. Both simultaneous and sequential methods for consolidating electro-deposition particles are described. Additionally, electro-chemical displacement and chemical deposition methods are described for the production of binary component powders which can be used in conjunction with electro-deposition methods. As many as four different component metals and/or non-metals may be incorporated into consolidated powders for use in the powder metallury production of alloys.
    Type: Grant
    Filed: September 9, 1975
    Date of Patent: September 6, 1977
    Inventor: Ralph E. Rippere
  • Patent number: 3994785
    Abstract: Electrolytic methods for making high density copper powder starting with copper powder of lower apparent density are disclosed. Copper powder of lower apparent density is used as a cathode for the formation of copper powder having a desired relatively high apparent density. According to one embodiment, an integral two-phase process is provided in which copper powder of relatively lower apparent density is formed by electrodeposition, and the powder so-formed is then used in a second phase electrodeposition process as a cathode on which copper powder of the desired relatively high apparent density is formed.
    Type: Grant
    Filed: January 9, 1975
    Date of Patent: November 30, 1976
    Inventor: Ralph E. Rippere