Patents by Inventor Ralph E. Simon

Ralph E. Simon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020104888
    Abstract: A system for reading encoded information includes a housing that has an aperture formed therein, a radiation source mounted within the housing that is used for emitting radiation through the aperture, and a radiation detector mounted within the housing that is used to receive radiation reflected back through the aperture. The radiation source can be an infrared light-emitting diode (LED), and the radiation detector can be a semiconductor sensor.
    Type: Application
    Filed: March 22, 2001
    Publication date: August 8, 2002
    Inventors: Ralph E. Simon, Thierry Hernoult, Livio Lascu, Spiro Zefferys, David Silverglate
  • Publication number: 20020063202
    Abstract: A multiple state opto-electronic switch, having at least three states, includes a moveable member operable to move over a plurality of discrete positions. The moveable member has a plurality of radiation modulating segments from which a plurality of groups are defined. An emitting source is operable to emit radiation. A plurality of detectors, sensitive to the radiation, are each mounted proximate and in fixed position relative to motion of the movable member. Each of the plurality of discrete positions corresponds to a respective mapping between the plurality of detectors and a selected group of the radiation modulating segments. Each group of radiation modulating segments controls the radiation passing from the emitting source to each of the detectors. The plurality of detectors thereby generates a set of output signals responsive to a position of the moveable member.
    Type: Application
    Filed: September 26, 2001
    Publication date: May 30, 2002
    Inventors: Ralph E. Simon, Thierry Hernoult, Livio Lascu
  • Patent number: 4590667
    Abstract: A wafer divided into rows of abutted end-to-end dice (i.e., semiconductor chips) is placed on a thin, non-elastic membrane and drawn tightly over a knife-edge to successively separate each row of dice from the membrane. The dice are then attached to individual leadframes directly or are picked up by a vacuum fixture and carried to a position where they are secured to the leadframes and are wire bonded. After bonding, the components are assembled into finished subassemblies. In one embodiment, LED lamps are fabricated. A reflector is secured to each leadframe over the die positioned thereon, and the leadframe, die and reflector are molded into a lamp subassembly, which is used to form a larger lamp or display fixture.
    Type: Grant
    Filed: August 22, 1984
    Date of Patent: May 27, 1986
    Assignee: General Instrument Corporation
    Inventor: Ralph E. Simon