Patents by Inventor Ralph H. Nielsen, Jr.

Ralph H. Nielsen, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Creating or removing a conductive layer on an insulator over a semiconductor
    Patent number: 4664746
    Abstract: A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.
    Type: Grant
    Filed: April 29, 1986
    Date of Patent: May 12, 1987
    Assignee: Hewlett-Packard Company
    Inventors: David E. Hackleman, Ralph H. Nielsen, Jr., Marzio A. Leban
  • Etching a layer over a semiconductor
    Patent number: 4596627
    Abstract: A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.
    Type: Grant
    Filed: June 13, 1985
    Date of Patent: June 24, 1986
    Assignee: Hewlett-Packard Company
    Inventors: David E. Hackleman, Ralph H. Nielsen, Jr., Marzio A. Leban
  • Utilizing controlled illumination for creating or removing a conductive layer from a SiO.sub.2 insulator over a PN junction bearing semiconductor
    Patent number: 4454004
    Abstract: A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.
    Type: Grant
    Filed: February 28, 1983
    Date of Patent: June 12, 1984
    Assignee: Hewlett-Packard Company
    Inventors: David E. Hackleman, Ralph H. Nielsen, Jr., Marzio A. Leban