Abstract: An apparatus for transferring chips from a first position to at least a second position includes: a rotatable transfer assembly including at least two transfer heads, each head for picking up a chip in the first position, and positioning the chip in the at least second position through rotation of the transfer assembly about an axis of rotation; a transfer assembly actuator for driving the transfer assembly together with the at least two transfer heads about the axis; and at least a first transfer head actuator structured for actuating at least one transfer head in a radial direction relative to the axis, the at least first transfer head actuator being mounted to the rotatable transfer assembly actuator and including an actuator element coupled to the at least one transfer head, the actuator element structured to be actuated in the direction of the axis relative to the rotatable transfer assembly actuator.

Abstract: A transfer head for an electronic component transfer apparatus and a method therefor. The transfer head includes a first vacuum pipet laterally spaced from a second vacuum pipet with a first pitch therebetween. The first pitch is variable between a first pitch position and a second pitch position.

Abstract: A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

Abstract: A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

Abstract: A transfer head for an electronic component transfer apparatus and a method therefor. The transfer head includes a first vacuum pipet laterally spaced from a second vacuum pipet with a first pitch therebetween. The first pitch is variable between a first pitch position and a second pitch position.

Abstract: An apparatus is provided for transferring a semiconductor device from a wafer to a target position. The apparatus has at least one rotatable transfer assembly, which has a transfer head rotatable about an axis of rotation of the rotatable transfer assembly to transfer a semiconductor device from a pick-up position to a transfer position. The apparatus also has a transfer assembly actuator arrangement operative to effect movement of the at least one rotatable transfer assembly in an axial direction relative to a plane of rotation of the transfer head.

Abstract: A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

Abstract: An apparatus is provided for transferring a semiconductor device from a wafer to a target position. The apparatus has at least one rotatable transfer assembly, which has a transfer head rotatable about an axis of rotation of the rotatable transfer assembly to transfer a semiconductor device from a pick-up position to a transfer position. The apparatus also has a transfer assembly actuator arrangement operative to effect movement of the at least one rotatable transfer assembly in an axial direction relative to a plane of rotation of the transfer head.