Abstract: A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from the center of the folded fin members and the folded fin members are thermally coupled to the slug. A gas circulating system is disposed over the slug and fin members projecting from the first surface of the base. The sidewall of a fin may be provided with at least one aperture. The top surface of the fin is closed, thereby permitting the fin to operate as a plenum of sorts. The bottom of the troughs may also be closed. The fins/troughs act as a plenum. A method of producing the folded fin heatsink member is also described.

Abstract: The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

Abstract: A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

Abstract: A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from the center of the folded fm members and the folded fin members are thermally coupled to the slug. A gas circulating system is disposed over the slug and fin members projecting from the first surface of the base. The sidewall of a fin may be provided with at least one aperture. The top surface of the fin is closed, thereby permitting the fin to operate as a plenum of sorts. The bottom of the troughs may also be closed. The fins/troughs act as a plenum. A method of producing the folded fin heatsink member is also described.

Abstract: The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

Abstract: A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.

Abstract: The present invention comprises a heatsink adjacent a first device wherein a gas supply can be located to provide gas in any direction with respect to the heatsink. The gas supply may be realized as a fan, a blower, or a compressed gas source. The gas supply may be provided in any direction or in multiple directions. The heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises a radial shaped folded fin heatsink arranged for axial flow.

Abstract: A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.

Abstract: A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

Abstract: A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from the center of the folded fm members and the folded fin members are thermally coupled to the slug. A gas circulating system is disposed over the slug and fin members projecting from the first surface of the base. The sidewall of a fin may be provided with at least one aperture. The top surface of the fin is closed, thereby permitting the fin to operate as a plenum of sorts. The bottom of the troughs may also be closed. The fins/troughs act as a plenum. A method of producing the folded fin heatsink member is also described.

Abstract: A heatsink interface material for securing a heatsink to an integrated circuit includes a core material having an adhesive forced into opposing surfaces of the core material. It is preferred that an intermediate region of the core material be free of adhesive. In one embodiment, copper is deposited on the first and second surfaces of the core material and then nickel is deposited on the first and second surfaces. An exemplary method for fabricating a heatsink interface material in accordance with the present invention can include applying heat and pressure to force adhesive into the core material. Copper and nickel can be deposited on the core material surfaces using electroless deposition techniques.

Abstract: A thermally efficient circuit board has a base layer with high thermal conductivity and a thermal expansion coefficient close to that of silicon, such as aluminum silicon carbide. Above the base layer is a layer of anodized metal, either a separate material, such as aluminum, which is formed on the base and then anodized, or an anodized portion of the base itself. To the anodized metal is then applied a sealant material of lower thermal conductivity, but good electrically insulative and adhesive qualities, such as Teflon FEP. The sealant flows into cavities in the porous anodized metal structure, creating a well-anchored bond. A metal foil layer is then bonded to the surface of the sealant, and used to pattern conductive circuit paths using conventional methods.

Abstract: A two-phase liquid cooling system for an electronic component comprised of flexible sealed bag which is partially filled with a liquid coolant. Sufficient residual non-condensing gas is maintained in the bag so that some of the gas dissolves in the liquid coolant when the device is not operating and at ambient temperature. During warmup, the residual gas comes out of solution and creates nucleation sites that assist in initiating boiling. The bag is air and fluid-impermeable, and has sufficient flexibility such that as coolant vaporizes, the bag expands to maintain the internal bag pressure substantially the same as the ambient environmental pressure. The bag may also be provided with a metal heat spreader plate which passes through a wall of the bag an assists with transferring heat from the component to the coolant. The heat spreader plate may be specially treated to allow the flexible bag material to by directly heat sealed to the plate and to provide nucleation sites to enhance coolant boiling.

Abstract: A two-phase liquid cooling system has a container structure that has at least one wall with sufficient flexibility that the wall expands as the coolant vapor expands thereby maintaining the internal container pressure substantially the same as the ambient environmental pressure. Coolant boiling overshoot is reduced by allowing residual gases to remain in the cooling system. More particularly, sufficient residual gas is maintained in the system so that some of the gas dissolves in the liquid coolant when the device is not operating and is at ambient temperature. During warm-up, the residual gas comes out of solution and creates nucleation sites that initiate boiling and prevent overshoot. Additional nucleation sites can also be added to reduce overshoot by treating the inside surfaces of the container structure, for example by laser machining, to create nucleation sites.

Abstract: A thermally efficient circuit board has a base layer with high thermal conductivity and a thermal expansion coefficient close to that of silicon, such as aluminum silicon carbide. Above the base layer is a layer of anodized metal, either a separate material, such as aluminum, which is formed on the base and then anodized, or an anodized portion of the base itself. To the anodized metal is then applied a sealant material of lower thermal conductivity, but good electrically insulative and adhesive qualities, such as Teflon FEP. The sealant flows into cavities in the porous anodized metal structure, creating a well-anchored bond. A metal foil layer is then bonded to the surface of the sealant, and used to pattern conductive circuit paths using conventional methods.

Abstract: A two-phase cooling system for a portable computer, the system consisting of an evaporator and a condenser that are both included in either the lid or the base of the computer. The two-phase cooling system is positioned proximate to the computer's heat-producing circuitry, such that the system draws liquid coolant past the circuitry and heat is transferred from the circuitry to the coolant. A fan may also be included, to assist in heat rejection from the cooling system. In a preferred embodiment, the cooling system consists of a flattened heat pipe, with a first side operating as the evaporator and a second side operating as the condenser.

Abstract: A two-phase liquid cooling system utilizes and evaporator unit for vaporizing a liquid coolant and a condenser unit for condensing the coolant vapor. The unit is capable of operating in at least two orientations: in one orientation, the condenser is located vertically above the evaporator and condensed coolant returns from the condenser to the evaporator under the force of gravity. In another orientation, the evaporator is located vertically above the condenser and the liquid coolant is returned to the evaporator by a stream of bubbles rising in a tube connecting the evaporator and the condenser. The stream of bubbles is produced by a small heater which is operated by a gravity controlled switch. A check valve is provided to insure that the bubble stream moves in the proper direction.

Abstract: A liquid crystal (LC) display monitor has a high luminosity light source to provide good visibility in brightly lit areas. To prevent overheating of the LC screen and other components of the monitor, a two-phase cooler is provided. The cooler consists of two translucent, flexible bag-like containers, each conforming to a different side of the light source. A low-boiling point coolant within the containers absorbs heat from the light source and is partially vaporized. The coolant vapor travels from the containers into a condenser which is external to the monitor cabinet. The condenser draws thermal energy out of the coolant vapor, causing it to condense and return to the containers. The containers provide shock absorption to protect the light source, and the containers or the coolant may have light-scattering properties to provide diffusion of the light.

Abstract: A two-phase liquid cooling system for an electronic component comprised of flexible sealed bag which is partially filled with a liquid coolant. Sufficient residual non-condensing gas is maintained in the bag so that some of the gas dissolves in the liquid coolant when the device is not operating and at ambient temperature. During warmup, the residual gas comes out of solution and creates nucleation sites that assist in initiating boiling. The bag is air and fluid-impermeable, and has sufficient flexibility such that as coolant vaporizes, the bag expands to maintain the internal bag pressure substantially the same as the ambient environmental pressure. The bag may also be provided with a metal heat spreader plate which passes through a wall of the bag an assists with transferring heat from the component to the coolant. The heat spreader plate may be specially treated to allow the flexible bag material to by directly heat sealed to the plate and to provide nucleation sites to enhance coolant boiling.

Abstract: A two-phase cooling apparatus uses a radioactive initiator to induce boiling in a liquid coolant, thus reducing thermal hysteresis. A radioactive source, such as spent uranium, is immersed in a liquid coolant bath to allow interaction between the emitted radiation and the liquid. A heat spreader plate may be used to conduct heat to the liquid from a unit to be cooled. An interior surface of a coolant chamber, such as the heat spreader plate, may be plated with a radioactive material to induce a high incidence of nucleation sites. A shielding material may also be used to shield the unit being cooled from the radioactive source. The radioactive source material may also be used to retrofit existing two-phase cooling systems.