Abstract: A system for cooling an electronic module in a computer system. In one embodiment of the invention, predetermined areas of the module, such as those exposed parts that carry electrical currents are covered with an conformable, electrically insulating layer. Thereafter, a second conformable, thermally conductive layer is formed on the first layer. In addition, surface expanding elements may be arranged on the first layer near devices particularly sensitive to heat before the application of the second layer.

Abstract: A heat exchange element having a heat receiving side and a heat dissipating side and having a serpentine member defining a first plurality of parallel elongate grooves, having elongate openings all in the heat receiving side, and a second plurality of parallel elongate grooves, having elongate openings all in the heat dissipating side, the grooves of the first plurality being interdigitated with the grooves of the second plurality, and closures which close all of the open ends of one of the pluralities of grooves. An enclosure for an electronic assembly having a rack in which electronic assemblies may be mounted in a vertical orientation, the rack being mounted in a cavity defined by side walls, a rear wall, a front wall, a top and a base which together separate the cavity from the environment surrounding the enclosure. At least one of the walls having one of the heat exchange elements sandwiched between an outer panel and an inner panel.

Abstract: A heat exchange element having a heat receiving side and a heat dissipating side and having a serpentine member defining a first plurality of parallel elongate grooves, having elongate openings all in the heat receiving side, and a second plurality of parallel elongate grooves, having elongate openings all in the heat dissipating side, the grooves of the first plurality being interdigitated with the grooves of the second plurality, and closures which close all of the open ends of one of the pluralities of grooves. An enclosure for an electronic assembly having a rack in which electronic assemblies may be mounted in a vertical orientation, the rack being mounted in a cavity defined by side walls, a rear wall, a front wall, a top and a base which together separate the cavity from the environment surrounding the enclosure. At least one of the walls having one of the heat exchange elements sandwiched between an outer panel and an inner panel.

Abstract: A semiconductor element is positioned between opposing faces of two thermally and electrically conductive members. An external force is then applied to the two members to move the opposing faces of the members toward each other and against the sides of the element. While this external force is maintained, the members are fixed in a housing by means of bonding means, and are separated from the housing by an electrically insulating, thermally conducting material, which may itself be the bonding means. Upon removal of the external force from the members, the members are held by the bonding means and the housing in thermal and electrical contact with the semiconductor element, and the assembly has been pre-stressed. During the operation of the semiconductor element the pressure is controlled by thermally responsive elements.