Patents by Inventor Ralph Lauwaert

Ralph Lauwaert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-Free Solder Alloy Comprising Sn, Bi and at Least One of Mn, Sb, Cu and its Use for Soldering an Electronic Component to a Substrate
    Publication number: 20190360075
    Abstract: A solder alloy comprises 38.0-42.0 wt % bismuth (Bi), 0.01-2 wt % of at least one further element chosen from the group of manganese (Mn), antimony (Sb) and copper (Cu), the balance being tin (Sn), and is at least substantially free of nickel (Ni), and further preferably substantially free of silver (Ag). The solder alloy may be combined with a halide-free solder flux to constitute a solder paste, solder bath or solder wire. The solder paste is for instance used for soldering electronic component packages such as quad flat non-leaded (QFN) packages or for soldering surface mount devices (SMD), resulting in low void formation. The solder alloy may also be applied by means of wave-soldering or selective soldering.
    Type: Application
    Filed: September 12, 2017
    Publication date: November 28, 2019
    Inventors: Daniel Werkhoven, Annick Peeters, Ralph Lauwaert, Isabelle Maris, Bart Van De Lisdonk, Steven Teliszewski