Abstract: A carrier for holding a substrate in a curved state is provided. The carrier comprises a carrier body having a curved substrate support surface, a sealing for providing a sealing between an edge of the substrate and the carrier body, and a substrate fixation for pressing the edge of the substrate onto the sealing. The carrier body comprises one or more gas supply conduits to provide a gas cushion between a back side of the substrate and the curved substrate support surface. Further, an apparatus for depositing a layer on a substrate in a curved state and a method for supporting a substrate in a curved state in a vacuum deposition chamber are provided.

Abstract: A substrate support of a processing chamber includes a support plate and a seal plate. The processing chamber includes a leveling system configured to raise and lower the support plate and the seal plate. The leveling system is configured to alter an orientation of the seal plate with respect to a chamber component, such as a liner assembly. The leveling system is configured to alter an orientation of the support plate with respect to a chamber component, such as a showerhead.

Abstract: A substrate support assembly includes a substrate support that is moveable by a shaft between a raised position and a lowered position below the raised position. A lift pin is disposed in a hole through the substrate support, and is movable vertically with respect to the substrate support. In one implementation, the lift pin includes a shaft with a longitudinal rib. In another implementation, a lift pin system includes a seal member in a lift pin housing that forms a seal against the lift pin. In another implementation, a lift pin system is adjustable to change a distance of an end of the lift pin from a datum. In another implementation, a lift pin system includes a hoop plate to which the lift pin is coupled. The hoop plate is coupled to an actuating plate via a plunger. The actuating plate is biased against an arm coupled to the shaft.

Abstract: A cluster tool for fabricating substrates includes a factory interface; a first processing mainframe coupled to the factory interface, including: a processing chamber monolithic structure including four processing chambers in the same housing; four load locks coupled to the processing chamber monolithic structure, each load lock including a heater assembly configured to increase the temperature of a substrate disposed in the load lock; and a swapper assembly disposed between the four load locks and the processing chamber monolithic structure, wherein the swapper assembly includes four swappers, each swapper configured to swap substrates between one processing chamber and one load lock along a linear trajectory.

Abstract: A carrier configured for holding and transporting a substrate in a transport direction in a vacuum processing system and a method for carrying a substrate in a transport direction during a deposition process in a deposition chamber with a carrier is described. The carrier includes two side edges opposing each other, a joining structure arranged between the side edges, having a flat structure comprising a plurality of apertures, each exposing the same substrate and an aperture ratio of at least 0.5, and a holding assembly configured for holding the substrate adjacent to the joining structure.

Abstract: A method for extracting a shielding element from a processing chamber of a substrate processing system or inserting the shielding element into the processing chamber is provided. The substrate processing system includes the processing chamber, a first shielding element for excluding application of material onto parts of a substrate, and a substrate transportation system for transporting substrates or substrate carriers into and out of the processing chamber. The method includes transporting the first shielding element by the substrate transportation system.

Abstract: A carrier for supporting a substrate in a substrate processing chamber for vacuum processing is described. The carrier includes a substrate fixation assembly, wherein the substrate fixation assembly includes one or more fixation units; a first fixation dement having a first surface configured for contacting a first substrate surface of the substrate; a second fixation element having a second surface configured for contacting a second substrate surface of the substrate; and a force dement for providing a fixation force for the substrate with at least one of the first and the second fixation element.

Abstract: A method for extracting a shielding element from a processing chamber of a substrate processing system or inserting the shielding element into the processing chamber is provided. The substrate processing system includes the processing chamber, a first shielding element for excluding application of material onto parts of a substrate, and a substrate transportation system for transporting substrates or substrate carriers into and out of the processing chamber. The method includes transporting the first shielding element by the substrate transportation system.

Abstract: A transfer device is provided for substrate transfer along a transport direction and for change between a first transport path and a second transport path extending along the transport direction. The first transport path is displaced with respect to the second transport path in a switch direction perpendicular to the transport direction. The transfer device includes a first substrate support assembly defining a first track to support a substrate or substrate carrier in a chamber. The transfer device further includes a second substrate support assembly defining a second track to support a substrate or substrate carrier in the chamber. The first substrate support assembly and the second substrate support assembly are moveable relative to each other at least in the switch direction.

Abstract: A lock chamber for a substrate processing system is provided which includes at least a first conduit adapted to provide an inner portion of the lock chamber in fluid communication with atmospheric pressure or overpressure. Additionally, the lock chamber includes at least a first control valve for controlling a flow rate of the fluid communication of the inner portion of the chamber with the atmospheric pressure or the overpressure, wherein the control valve is adapted to continuously control the flow rate. Furthermore, an according method, a computer program and a computer readable medium adapted for performing the method is provided.

Abstract: An deposition apparatus for forming a deposition material layer on a substrate is described. The deposition apparatus includes a substrate support adapted for holding a substrate; and an edge (660) exclusion mask (640) for covering a periphery of the substrate (610) during layer deposition. The mask has at least one frame portion defining an aperture. The at least one frame portion of the mask is adapted for being moved (670,680) with respect to the substrate depending on the amount of deposition material deposited on the at least one frame portion of the mask. Further, a method for depositing a deposition material layer on a substrate using an edge exclusion mask is described.

Abstract: A cathode assembly for a sputter deposition apparatus and a method for coating a substrate is provided. The cathode assembly has a coating side for coating on a substrate. Further, the cathode assembly includes a rotary target assembly adapted for rotating a target material around a rotary axis; at least a first magnet having an inner magnet pole and at least one outer magnet poles and being adapted for generating one or more plasma regions. The cathode assembly has a first angular coordinate for a magnet pole, the magnet pole being provided for the coating side, and a second angular coordinate for a further magnet pole, the magnet pole being provided for the coating side; wherein the first angular coordinate and the second angular coordinate define an angle a larger than about 20 degrees and smaller than about 160 degrees.

Abstract: The present disclosure describes a method of coating a substrate, the method including forming a layer of sputtered material on the substrate. Forming the layer of sputtered material may include: sputtering material from at least one rotatable target over the substrate; varying the relative position between the at least one target and the substrate. In addition, the present disclosure describes varying the distance between a target and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate.

Abstract: A holding device adapted for holding a mask and a substrate during processing is described. The holding device includes a substrate carrier adapted for carrying the substrate; and a mask for masking the substrate, wherein the mask is releasably connected to the substrate carrier; wherein the substrate carrier or the mask has at least one recess adapted for receiving a cover for covering the substrate carrier during deposition.

Abstract: A lock chamber for a substrate processing system is provided which includes at least a first conduit adapted to provide an inner portion of the lock chamber in fluid communication with atmospheric pressure or overpressure. Additionally, the lock chamber includes at least a first control valve for controlling a flow rate of the fluid communication of the inner portion of the chamber with the atmospheric pressure or the overpressure, wherein the control valve is adapted to continuously control the flow rate. Furthermore, an according method, a computer program and a computer readable medium adapted for performing the method is provided.

Abstract: A holding device adapted for holding a mask and a substrate during processing is described. The holding device includes a substrate carrier adapted for carrying the substrate; and a mask for masking the substrate, wherein the mask is releasably connected to the substrate carrier; wherein the substrate carrier or the mask has at least one recess adapted for receiving a cover for covering the substrate carrier during deposition.

Abstract: This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a target (4) with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies (2) with rotatable, curved targets (4) positioned one beside the other.

Abstract: A coating system 1 comprises a swing station 2 including a swing module and an arrangement of chambers. The arrangement of chambers comprises a lock chamber 3 and a first coating chamber 4. The lock chamber 3 is configured as a combined lock-in/lock-out chamber. The arrangement of chambers has a first substantially linear transport path T1 indicated by dashed lines, and a second substantially linear transport path T2 indicated by dashed lines. The arrangement of the paths T1 and T2 establishes a dual track. The system 1 includes a transport system for moving a substrate through the arrangement of chambers 3, 4 along the first transport path T1 and/or along the second transport path T2 as indicated by arrows. One or particularly both chambers 3 and 4 comprise transfer means for transferring the substrate/carrier from the first path T1 to the second path T2 by a lateral movement of a dual or triple track section and/or from the second path T2 to the first path T1.

Abstract: The present disclosure relates to an anode rod for a sputtering system comprising a target, a lateral surface area of the anode rod is at least 2 times greater than the lateral surface area of the a circular cylinder having the same volume. Further, the present disclosure relates to a sputtering system comprising at least one anode rod, wherein the anode rod having a lateral surface area that is at least 2 times greater than the lateral surface area of the a circular cylinder having the same volume, and at least one sputtering cathode assembly comprising a backing device selected of the group consisting of a backing plate for a planar target, and a target backing tube for a rotatable cylindrical target.

Abstract: An arrangement for transporting a flat substrate through a coating installation, wherein the coating installation comprises, e.g., several and different sputter cathodes, to which the flat substrate, for example a glass pane, is transported one after the other in vacuo. So that no abrasion is generated between glass pane and contact, the glass pane is kept spaced apart from the contact by means of gas pressure. The gas pressure is herein built up through relatively few and small holes in a gas channel. Since during flooding of the coating installation to atmospheric pressure or during evacuation, due to the small holes, no fast pressure equalization between gas channel and the remaining coating installation is possible, the gas channel is decoupled in terms of gas from the remaining coating installation and provided with a separate gas line, via which gas can be introduced into the gas channel or pumped out of it.