Patents by Inventor Ralph M. Tusler
Ralph M. Tusler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7518854Abstract: In one embodiment, a removable storage module for use in a module cage includes a latch mechanism including: a latch arm that is used to rotate the mechanism about an axis, and a top portion that includes at least one latch tooth and a paddle member, the latch tooth comprising a first surface that is adapted to abut a rear side of a first flange of the cage during insertion of the module and a second surface that is adapted to abut a second flange of the cage during removal of the module, the paddle member being adapted to abut a front side of the first flange during removal of the module.Type: GrantFiled: August 9, 2007Date of Patent: April 14, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Everett R. Salinas, Herbert J. Tanzer, Ralph M. Tusler
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Patent number: 7272012Abstract: In one embodiment, a removable storage module includes a bezel, and opposed first and second rails that extend from the bezel, the first rail including a key system component that is adapted to prevent full insertion of the module into a bay of a module cage so as to protect a connector of at least one of the module and the cage. In another embodiment, a removable storage module for use in a module cage includes a latch mechanism including: a latch arm that is used to rotate the mechanism about an axis, and a top portion that includes at least one latch tooth and a paddle member, the latch tooth comprising a first surface that is adapted to abut a rear side of a first flange of the cage during insertion of the module and a second surface that is adapted to abut a second flange of the cage during removal of the module, the paddle member being adapted to abut a front side of the first flange during removal of the module.Type: GrantFiled: September 30, 2004Date of Patent: September 18, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Everett R. Salinas, Herbert J. Tanzer, Ralph M. Tusler
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Publication number: 20030072135Abstract: A heat sink assembly for use with edge connectors, e.g., card edge connectors, of cards or printed circuit boards. The heat sink assembly provides a relatively large heat transfer capacity to control temperatures in contacts of the edge connectors which increases the current rating of the connector by allowing more current to pass through the connector. The heat sink assembly includes fins attached to the edge connector power and ground leads by direct thermal connection, such as soldering, to traces in the board. The fins are connected to the power and ground leads in an alternating or interweaved fashion. The fins are fabricated from thermal conducting material and heat is conducted to the fins where it is removed by the relatively large surface area of the fins. Adjacent fins are electrically isolated such that power and ground fins do not contact.Type: ApplicationFiled: October 12, 2001Publication date: April 17, 2003Inventors: Kevin J. Lonergan, Ralph M. Tusler, Richard A. Gaudet
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Patent number: 6545872Abstract: A heat sink assembly for use with edge connectors, e.g., card edge connectors, of cards or printed circuit boards. The heat sink assembly provides a relatively large heat transfer capacity to control temperatures in contacts of the edge connectors which increases the current rating of the connector by allowing more current to pass through the connector. The heat sink assembly includes fins attached to the edge connector power and ground leads by direct thermal connection, such as soldering, to traces in the board. The fins are connected to the power and ground leads in an alternating or interweaved fashion. The fins are fabricated from thermal conducting material and heat is conducted to the fins where it is removed by the relatively large surface area of the fins. Adjacent fins are electrically isolated such that power and ground fins do not contact.Type: GrantFiled: October 12, 2001Date of Patent: April 8, 2003Assignee: Compaq Information Technologies Group, L.P.Inventors: Kevin J. Lonergan, Ralph M. Tusler, Richard A. Gaudet
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Patent number: 5483423Abstract: This disclosure pertains to an apparatus and method of providing EMI shielding for an electrical component. The apparatus includes an elastomeric gasket, which is coated with a conductive jacket, and which is mounted on the backplane of a cabinet, the backplane providing EMI shielding. The cabinet is adapted for the insertion of a plurality of electrical components, such as disk drives, tape drives, and power supplies, which themselves are mounted in a rigid frame member. The frame member includes EMI shielding for the components on five of their six sides. The sixth side is unshielded, due to the fact that it contains the electrical connector used to connect the component to the backplane of the cabinet, when the frame member is inserted in the cabinet. With the frame member providing shielding on five sides, and the backplane providing shielding for the sixth side, the gasket serves the purpose of establishing an electrical seal between the frame member and the backplane of the cabinet.Type: GrantFiled: January 9, 1995Date of Patent: January 9, 1996Assignee: Digital Equipment CorporationInventors: Mark S. Lewis, Reuben M. Martinez, Ralph M. Tusler
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Patent number: 5313369Abstract: A simple, low cost, reduced tolerance interconnect enclosure in which a blind m A siVpV:interconnect between modules and the backplane may be guaranteed without the need for assembly fixtures or floating connectors, and a method of manufacturing the enclosure. The enclosure includes two matching enclosure sections for holding a backplane. The backplane has spaced apart recesses on opposing edges. Each enclosure section includes alignment protrusions spaced apart to engage the backplane recesses. These protrusions have curved apex regions and a height greater than the depth of the backplane recesses. Means for latching the enclosure sections together are provided, and the enclosure sections are dimensioned such that when the enclosure sections are closed around the backplane, the protrusions from the enclosure sections are urged against the recesses on the backplane.Type: GrantFiled: November 3, 1992Date of Patent: May 17, 1994Assignee: Digital Equipment CorporationInventors: Mark S. Lewis, Lori A. Treseder, Reuben Martinez, Ralph M. Tusler
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Patent number: D588601Type: GrantFiled: January 15, 2008Date of Patent: March 17, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Qiang Wang, Ralph M. Tusler
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Patent number: D353800Type: GrantFiled: April 27, 1992Date of Patent: December 27, 1994Assignee: Digital Equipment Corp.Inventors: Mark S. Lewis, Lori A. Treseder, Ralph M. Tusler, Greg Suzda