Abstract: A semiconductor module has a layer structure and at least one capacitive sensor. The layer structure is formed with an upper electrode layer, a lower electrode layer, and an active layer arranged between the electrode layers. The active layer is made of a semiconductor material. The capacitive sensor has a measuring electrode which is integrated into the layer structure. There is also described a device which has such a semiconductor module and a method for producing such a semiconductor module.

Abstract: A solution-processed organic electronic structural element has an improved electrode layer. Located between the active organic layer and the electrode layer there is either an interface or an interlayer containing a cesium salt.

Abstract: The description covers cabin components for aircraft, which can be produced with a sandwich structure and may have the components 1003 for signal and/or power transmission. The cabin components in this case have at least two prepreg layers 1001, 1005 and, for example, a honeycomb layer 1002, which can be connected to one another by pressing and heating. Furthermore, electrical and/or optical signal paths are shown on cabin components, which can be produced by positioning them there or printing. In addition, according to the description, signal and/or power transmission can take place beyond the boundary of cabin components, by means of a transmitter/receiver path.

Abstract: The invention relates to a system for regulating an adjustable brightness level in a cabin of an aeroplane, having a control device, which is designed to regulate a preset brightness value and has at least the following components: an input unit for inputting a predetermined brightness value, at least one sensor detecting the brightness, an adjusting device for influencing at least one light source on the basis of a brightness value determined by the sensor.

Abstract: A solution-processed organic electronic structural element has an improved electrode layer. Located between the active organic layer and the electrode layer there is either an interface or an interlayer containing a cesium salt.

Abstract: A luminous device is provided comprising LEDs with an LED controller for adjusting a luminous characteristic of the LEDs, and a data receiver (10). The data receiver (10), is connected to the LED controller (9), for wireless reception of data (D). The controller (4) is configured in such a way that, in predetermined switching stage (S3) of the controller (4), the data receiver (10) can be or is activated, and in the case of an activated data receiver (10), the luminous characteristic of the LEDs (3) can be adjusted exclusively by the LED controller (9) depending on data (D) received by the data receiver (10).

Abstract: The description covers cabin components for aircraft, which can be produced with a sandwich structure and may have the components 1003 for signal and/or power transmission. The cabin components in this case have at least two prepreg layers 1001, 1005 and, for example, a honeycomb layer 1002, which can be connected to one another by pressing and heating. Furthermore, electrical and/or optical signal paths are shown on cabin components, which can be produced by positioning them there or printing. In addition, according to the description, signal and/or power transmission can take place beyond the boundary of cabin components, by means of a transmitter/receiver path.

Abstract: An organic radiation-emitting component (1) comprising an organic layer (2) formed for generating radiation, and comprising a radiation coupling-out side is specified, a scattering film (8) being arranged on the radiation coupling-out side of the component and being connected to the component.

Abstract: In a method for producing a parylene coating on a substrate containing an integrated electronic component which is e.g. an x-ray detector, the following steps are provided: vaporization of parylene; pyrolyzation of the vaporized parylene; polymerization of the pyrolyzed parylene, the polymerized parylene being deposited on a cooled substrate. The method provides controllable, patterned deposition of parylene on the cooled and/or heated substrate, the advantage being that x-ray converters, for example, can be anticorrosively encapsulated and a penetration depth of the parylene between phosphor needles or storage phosphor needles can be controlled, resulting in an improved resolution and improved modulation transfer function of electronic components.

Abstract: A solution-processed organic electronic structural element has an improved electrode layer. Located between the active organic layer and the electrode layer there is either an interface or an interlayer containing a cesium salt.

Abstract: A radiation emitting electronic device (1) comprising a substrate (5), a radiation emitting functional area (10A, 10B, 15) on the substrate (5) and a radiation out-coupling material (20) comprising polysilsesquioxane (20D) and inorganic nanoparticles (20C) arranged in the optical path (100) of the radiation emitting functional area (10A, 10B, 15). Such a device has a higher luminance due to an increased fraction of out-coupled radiation in comparison to a device having no radiation out-coupling material.

Abstract: A device (2) for scanning or copying a document and for storing a scanned image or image to be copied, includes a document support (4), a reader (6) and a storage device (8). The storage device (8) includes bi-stable components. The bi-stable components consist of several alternating layers of organic material and electrodes.

Abstract: A planar electronic component has a functional layer with an optoelectronic or a circuit configuration between a substrate layer and a covering layer. A sealing frame or sealing ring is disposed between the substrate layer and the covering layer and connected to them by an integral joint surrounding the functional layer. The seal very largely protects the functional layer against hazardous external influences, in particular against moisture and oxygen. A mechanical connector, whose adhesive characteristics are matched to the materials of the covering layer and of the substrate, is provided in addition to the sealing ring. The connector fixes the substrate and covering layers mechanically with respect to one another, and may reduce the risk of partial or complete detachment in the event of deformation of the electronic component, in particular as a result of thermal expansion and/or mechanical loading.

Abstract: The invention relates to an encapsulation for an organic electronics component, particularly an OLED, which can be produced by simple coating methods or printing methods and which still has a high degree of tightness with regard to environmental influences that are detrimental to the organic electronics component. This is made possible by the use of so-called fusible alloys, i.e., low-melting point metallic alloys that combine a low melting point with a high tightness from moisture and oxidizing gases.

Abstract: The production of electronic and/or optoelectronic components on a flexible film (1) can be adapted without a high effort to existing installations, which are usually based on a batch process, by virtue of the fact that, during the production method, the flexible film (1) is fixed on a carrier (2), which is sufficiently mechanically stable for the further processing of the film (1). The film (1) is connected to the carrier (2) by a magnetic layer (3) or a thermoplastic material. After the further processing of the film (1), the carrier (2) can be removed from the film (2) in a state in which it can be reused.

Abstract: A planar electronic component has a functional layer with an optoelectronic or a circuit configuration between a substrate layer and a covering layer. A sealing frame or sealing ring is disposed between the substrate layer and the covering layer and connected to them by an integral joint surrounding the functional layer. The seal very largely protects the functional layer against hazardous external influences, in particular against moisture and oxygen. A mechanical connector, whose adhesive characteristics are matched to the materials of the covering layer and of the substrate, is provided in addition to the sealing ring. The connector fixes the substrate and covering layers mechanically with respect to one another, and may reduce the risk of partial or complete detachment in the event of deformation of the electronic component, in particular as a result of thermal expansion and/or mechanical loading.