Abstract: Screening of a workpiece utilizing a screening apparatus which includes a paste dispensing apparatus and a trailing squeegee assembly in close proximity to the paste dispensing apparatus. When the screening apparatus is operable, the squeegee assembly is in contact with the workpiece at the same time as a paste is dispensed from the paste dispensing apparatus.

Abstract: A method for displacing an article using first and second pallets for holding and transporting an article between two process stations and an H-bar assembly for receiving the first and second pallets, the method including the steps of: receiving the first and second pallets and articles thereon by the H-bar assembly at one of the two process stations; performing a first process on the articles while received by the H-bar assembly; moving the first and second pallets and articles thereon to a second process station; and performing a second process on the articles while at the second process station.

Abstract: An apparatus for displacing an article including first and second pallets for holding and transporting an article between two process stations; an H-bar assembly for receiving the first and second pallets at one of the two process stations; wherein, in operation, a process is performed on the articles while the first and second pallets are received by the H-bar assembly, the pallets then being transported to the second process station where a second process is performed on the articles.

Abstract: Disclosed is an interposer and test structure for making contact between a substrate and a test bed. One embodiment of the interposer has a floating, rigid conductive element in a nonconductive body which makes temporary contact between the test bed and the substrate. In another embodiment of the invention, the interposer includes two layers of material, in which one layer includes pogo pins for contacting the substrate and the other layer includes pads for contacting the test bed. The pogo pins are on a grid spacing corresponding to that of the substrate input/output pads while the interposer pads are on a grid spacing corresponding to that of the pogo pin contactors of the test bed.

Abstract: A reference chuck which is used with a leveling device for holding microelectronic substrates and other electronic component substrates for laser ablation and other exposure processes, the chuck comprising a frame body for supporting the substrate to be processed, clamping means at the periphery of the frame body for holding the substrate to the frame body and elastomeric means for urging the substrate mounted in the reference chuck against the clamping means. The undersides of the clamping means which contacts the upper surface of the substrate forms in its tightened position a clamping plane which clamping plane is parallel with an established plane of the lower surface of the chuck. The reference chuck provides a very low profile envelope for use with conventional leveling devices and the top surface of the substrate and the lower surface of the reference chuck are in parallel planes when the chuck is placed on the working surface of the leveling device.