Abstract: Screening of a workpiece utilizing a screening apparatus which includes a paste dispensing apparatus and a trailing squeegee assembly in close proximity to the paste dispensing apparatus. When the screening apparatus is operable, the squeegee assembly is in contact with the workpiece at the same time as a paste is dispensed from the paste dispensing apparatus.

Abstract: A method for displacing an article using first and second pallets for holding and transporting an article between two process stations and an H-bar assembly for receiving the first and second pallets, the method including the steps of: receiving the first and second pallets and articles thereon by the H-bar assembly at one of the two process stations; performing a first process on the articles while received by the H-bar assembly; moving the first and second pallets and articles thereon to a second process station; and performing a second process on the articles while at the second process station.

Abstract: An apparatus for displacing an article including first and second pallets for holding and transporting an article between two process stations; an H-bar assembly for receiving the first and second pallets at one of the two process stations; wherein, in operation, a process is performed on the articles while the first and second pallets are received by the H-bar assembly, the pallets then being transported to the second process station where a second process is performed on the articles.

Abstract: A system for chemical-mechanical polishing is described which includes a wafer backing film having concentric first and second portions, and a wafer carrier having corresponding first and second portions for mounting the portions of the wafer backing film thereon. The portions of the wafer backing film are of different materials. The second portion of the wafer backing film has an annular shape and surrounds the first portion; the second portion of the wafer carrier is adjustable with respect to the first portion of the wafer carrier in a vertical direction. The second portion of the wafer backing film is less compressible than the first portion, and is adjusted in the vertical direction so that the outer edge of the wafer is substantially sealed when backside air is applied to the wafer during a film removal process.

Abstract: An actuator for use in positioning a probe. The actuator has a magnet, two C-shaped cores on opposite sides of the magnet, an electromagnetic coil, and an armature movably connected with the cores. The armature has a projecting face located over portions of both pole faces for each core for the entire range of motion of the armature. The armature is primarily retained with the cores by magnetic attraction by the magnet. The actuator also has an armature position sensor which can include either an optical sensor or a magnetic sensor. A test probe is mounted to the armature which can be preloaded and have dual springs to prevent scrubbing and increase contact force with an object being tested.