Abstract: A cable includes twisted pairs of insulated conductors. Each twisted pair includes two insulated conductors twisted together in a helical manner. The twisted pairs are grouped together to define a central core of the cable. An inner filler element is wrapped helically around the twisted pairs of the central core. An outer filler element is wrapped helically around the twisted pairs of the central core. The outer filler element is wrapped over the inner filler element.

Abstract: A cable includes twisted pairs of insulated conductors. Each twisted pair includes two insulated conductors twisted together in a helical manner. The twisted pairs are grouped together to define a central core of the cable. An inner filler element is wrapped helically around the twisted pairs of the central core. An outer filler element is wrapped helically around the twisted pairs of the central core. The outer filler element is wrapped over the inner filler element.

Abstract: A connector assembly comprising a housing having a jack interface that has a receptacle jack therein, which is configured to receive a plug. The connector assembly also includes a sensor bezel removably attachable to said jack interface. The sensor bezel includes an outer frame configured to engage the jack interface. The sensor bezel also includes jack cavities extending therethrough to allow passage of a plug when inserted into said receptacle jack. A sensor array is secured to the outer frame proximate the jack cavities. The sensor array comprises a sensor contact overlaying the jack interface. The sensor contact is aligned with, and configured to engage, a sensor probe associated with a plug insertable into the receptacle jack.

Abstract: A unique process for the removal of organic polymer photoresist and contaminants from the surface of substrates such as semiconductor wafers is disclosed. The process uses a preferred operating power to pressure ratio (where power is measured in watts per cm.sup.3 of plasma and pressure in torr) of less than about 0.150. Pressures of from 10 to 50 torr, and power input of from 200 to 500 watts per cathode can be used to minimize radiation damage to the substrate, and avoid the necessity of using remotely generated plasmas. Additionally, the process minimizes device contamination by post-strip residues (organic and/or inorganic), since only a deionized water rinse is required. Processing time is also reduced.