Abstract: Techniques for liquid cooling systems are disclosed. In one embodiment, jet holes in a water block create jets of liquid coolant to be applied to a surface to be cooled, such as a surface of an integrated circuit component. The jets of liquid coolant may disrupt surface boundary layers through turbulence and/or microcavitation, increasing the cooling effect of the liquid coolant. In the illustrative embodiment, negative pressure is applied to a coolant loop of the liquid coolant, which provides several advantages such as being resistant to leaks. In another embodiments, jet holes in a water block create jets of liquid coolant that are directed toward other jets of liquid coolant, which also increases the cooling effect of the liquid coolant.

Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.

Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.

Abstract: A single power distribution board having pin coded connectors may be used for both AC and DC power distribution to appropriate AC and/or DC power supplies in an information handling system. A common conductive layer may be used for either AC neutral or DC power supply return so as to eliminate one conductive layer in the power distribution board. Alternatively, total isolation of AC and DC power source inputs allow both AC and DC power supplies to operate together in a robust, redundant fashion. The DC power supplies in combination with a battery system may be used as an inexpensive uninterruptable power supply for the information handling system. Various DC and/or AC source voltages and frequencies may be coupled to appropriate power supplies through the pin coded connectors.

Abstract: A motherboard is secured in a chassis by a spring loaded plunger. An anchor member is mounted in the chassis. The anchor member includes a ramp and a receiver. The motherboard has an opening formed therein. A first member is secured to the motherboard. A second member is resiliently mounted on the first member so that the second member extends through the opening. The motherboard is moved on the chassis so that the second member is moved in a first direction by engaging the ramp, and the resilient mounting of the second member urges the second member in a second direction into the receiver.

Abstract: A computer chassis includes a first metal portion and a second metal portion. A mating edge connection is provided between the first and second portions. A gasket is mounted in the edge connection. The gasket includes a compressible strip of electromagnetic interference (EMI) limiting material. A pattern of holes is formed in the strip to improve compressibility and thus enhance EMI shielding.

Abstract: A heat sink retention system and method secures a heat sink proximate to a packaged electronic component, such as central processing unit, by rotationally engaging the heat sink with a retaining structure secured to an information handling system planar, such as a motherboard. The retaining structure has an opening aligned with the packaged electronic component and securing lips that extend into the opening. The heat sink inserts into the opening and is rotated slightly to engage flanges extending from its base into the securing lips. The position of the securing lips relative to the planar and the thickness of the flanges results in the base of the secured heat sink having a predetermined clearance from the packaged electronic component. A locking detent biases the heat sink to contact the packaged electronic component and allows limited movement out to the predetermined clearance, thus allowing the absorption of shock without excessive heat sink movement.

Abstract: A motherboard is secured in a chassis by a spring loaded plunger. An anchor member is mounted in the chassis. The anchor member includes a ramp and a receiver. The motherboard has an opening formed therein. A first member is secured to the motherboard. A second member is resiliently mounted on the first member so that the second member extends through the opening. The motherboard is moved on the chassis so that the second member is moved in a first direction by engaging the ramp, and the resilient mounting of the second member urges the second member in a second direction into the receiver.

Abstract: A heat sink retention system and method secures a heat sink proximate to a packaged electronic component, such as central processing unit, by rotationally engaging the heat sink with a retaining structure secured to an information handling system planar, such as a motherboard. The retaining structure has an opening aligned with the packaged electronic component and securing lips that extend into the opening. The heat sink inserts into the opening and is rotated slightly to engage flanges extending from its base into the securing lips. The position of the securing lips relative to the planar and the thickness of the flanges results in the base of the secured heat sink having a predetermined clearance from the packaged electronic component. A locking detent biases the heat sink to contact the packaged electronic component and allows limited movement out to the predetermined clearance, thus allowing the absorption of shock without excessive heat sink movement.

Abstract: An information handling system status indicator assembly includes a power jack, cabling and an indicator. The status indicator assembly connects with a status port located at the rear of an information handling system component and operates to provide a visible status indication of the component on the components cable management assembly and visible from a position behind the rack.

Abstract: An information handling system status indicator assembly includes a power jack, cabling and an indicator. The status indicator assembly connects with a status port located at the rear of an information handling system component and operates to provide a visible status indication of the component on the components cable management assembly and visible from a position behind the rack.

Abstract: A computer chassis includes a first metal portion and a second metal portion. A mating edge connection is provided between the first and second portions. A gasket is mounted in the edge connection. The gasket includes a compressible strip of electromagnetic interference (EMI) limiting material. A pattern of holes are formed in the strip to improve compressibility and thus enhance EMI shielding.

Abstract: A computer chassis includes a first metal portion and a second metal portion. A mating edge connection is provided between the first and second portions. A gasket is mounted in the edge connection. The gasket includes a compressible strip of electromagnetic interference (EMI) limiting material. A pattern of holes are formed in the strip to improve compressibility arid thus enhance EMI shielding.

Abstract: A computer chassis includes a first metal portion and a second metal portion. A mating edge connection is provided between the first and second portions. A gasket is mounted in the edge connection. The gasket includes a compressible strip of electromagnetic interference (EMI) limiting material. A pattern of holes is formed in the strip to improve compressibility and thus enhance EMI shielding.