Abstract: This invention relates to a carrier for transporting integrated circuit devices. In particular, the carrier is configured to cradle devices which have preformed leads which usually extend around the perimeter of the device and tend to be fairly fragile. The carrier is made up of a carrier top and a carrier bottom, which are securely closed through the attachment of several spring clamps. The bottom provides a secure nest which is configured to the shape of the body of the device. The top includes a hold-down member which houses two rings, a compression ring and a contact ring, within a channel. The compression ring is made of a rubber like material that can elastically compress under contact pressure, while the contact ring is made of a hard material, which will not stick to the top of the device. The contact ring, which is positioned between the compression ring and the device, engages the device when the carrier top and the carrier bottom are mated.