Patents by Inventor Rama K. Shukla

Rama K. Shukla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Markings for aligning fiber optic bundle
    Patent number: 6928216
    Abstract: A lithographic process is used to place a marking on a waveguide to indicate optical channels within the waveguide. A photonic component is positioned against the waveguide based on the markings and adjusted until aligned.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: August 9, 2005
    Assignee: Intel Corporation
    Inventors: Venkatesan Murali, Rama K. Shukla
  • Markings for aligning fiber optic bundle
    Publication number: 20040057668
    Abstract: A lithographic process is used to place a marking on a waveguide to indicate optical channels within the waveguide. A photonic component is positioned against the waveguide based on the markings and adjusted until aligned.
    Type: Application
    Filed: September 26, 2003
    Publication date: March 25, 2004
    Inventors: Venkatesan Murali, Rama K. Shukla
  • Markings for aligning fiber optic bundle
    Patent number: 6636671
    Abstract: A lithographic process is used to place a marking on a waveguide to indicate optical channels within the waveguide. A photonic component is positioned against the waveguide based on the markings and adjusted until aligned.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 21, 2003
    Assignee: Intel Corporation
    Inventors: Venkatesan Murali, Rama K. Shukla
  • Photonic and electronic components on a shared substrate
    Patent number: 6450699
    Abstract: A device has both electronic and photonic components on a shared substrate. The electronic components may include a light source for providing a photonic signal around the substrate to the photonic components.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: September 17, 2002
    Assignee: Intel Corporation
    Inventors: Venkatesan Murali, Rama K. Shukla
  • Photonic and electronic components on a shared substrate
    Publication number: 20020076170
    Abstract: A device has both electronic and photonic components on a shared substrate. The electronic components may include a light source for providing a photonic signal around the substrate to the photonic components.
    Type: Application
    Filed: December 19, 2000
    Publication date: June 20, 2002
    Inventors: Venkatesan Murali, Rama K. Shukla
  • Markings for aligning fiber optic bundle
    Publication number: 20020076163
    Abstract: A lithographic process is used to place a marking on a waveguide to indicate optical channels within the waveguide. A photonic component is positioned against the waveguide based on the markings and adjusted until aligned.
    Type: Application
    Filed: December 19, 2000
    Publication date: June 20, 2002
    Inventors: Venkatesan Murali, Rama K. Shukla
  • Method for coupling surface mounted capacitors to semiconductor packages
    Patent number: 5842626
    Abstract: A low cost method for mechanically and electrically coupling a surface mounted capacitor to a semiconductor package. In one embodiment a metal coating is deposited over the electrodes of a capacitor. Concurrently, or at some other time, solder paste is applied to the electrical contact pads of a semiconductor package. The connection between the capacitor and package is made by positioning the metal coated regions of the capacitor over the electrical contact pads of the package and running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the capacitor and onto the electrical contact pads of the package.
    Type: Grant
    Filed: October 24, 1997
    Date of Patent: December 1, 1998
    Assignee: Intel Corporation
    Inventors: Ameet S. Bhansali, Rama K. Shukla