Patents by Inventor Rama Krishna KOTLANKA
Rama Krishna KOTLANKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11538709Abstract: A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether (18) is formed on dice regions (16) of a first wafer (30), followed by attachment of a second wafer (32) to the tethers. The dice regions (16) are processed so as to be separated, followed by transfer printing of the dice regions to a third wafer (34).Type: GrantFiled: February 17, 2018Date of Patent: December 27, 2022Assignee: Analog Devices International Unlimited CompanyInventors: James G. Fiorenza, Susan L. Feindt, Michael D. Delaus, Matthew Duffy, Ryan Iutzi, Kenneth Flanders, Rama Krishna Kotlanka
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Publication number: 20210134641Abstract: A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether (18) is formed on dice regions (16) of a first wafer (30), followed by attachment of a second wafer (32) to the tethers. The dice regions (16) are processed so as to be separated, followed by transfer printing of the dice regions to a third wafer (34).Type: ApplicationFiled: February 17, 2018Publication date: May 6, 2021Inventors: James G. Fiorenza, Susan L. Feindt, Michael D. Delaus, Matthew Duffy, Ryan lutzi, Kenneth Flanders, Rama Krishna Kotlanka
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Patent number: 9668791Abstract: A surgical implant device comprising: a nail, a first locking screw and a second locking screw, each of the first locking screw and the second locking screw are secured near one end of the nail to form an architecture having a substantial triangular shape, a first reinforcing screws being releasably mounted along the length of the nail.Type: GrantFiled: April 4, 2012Date of Patent: June 6, 2017Inventors: Kok Sun Khong, Rama Krishna Kotlanka
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Patent number: 9272899Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.Type: GrantFiled: January 7, 2015Date of Patent: March 1, 2016Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.Inventors: Rama Krishna Kotlanka, Rakesh Kumar, Premachandran Chirayarikathuveedu Sankarapillai, Huamao Lin, Pradeep Yelehanka
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Publication number: 20150115453Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.Type: ApplicationFiled: January 7, 2015Publication date: April 30, 2015Inventors: Rama Krishna KOTLANKA, Rakesh KUMAR, Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI, Huamao LIN, Pradeep YELEHANKA
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Publication number: 20150038967Abstract: A surgical implant device comprising: a nail, a first locking screw and a second locking screw, each of the first locking screw and the second locking screw are secured near one end of the nail to form an architecture having a substantial triangular shape, a first reinforcing screws being releasably mounted along the length of the nail.Type: ApplicationFiled: April 4, 2012Publication date: February 5, 2015Inventors: Kok Sun Khong, Rama Krishna Kotlanka
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Patent number: 8940616Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.Type: GrantFiled: July 27, 2012Date of Patent: January 27, 2015Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.Inventors: Rama Krishna Kotlanka, Rakesh Kumar, Premachandran Chirayarikathuveedu Sankarapillai, Huamao Lin, Pradeep Yelehanka
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Patent number: 8805467Abstract: A probe element and a method of forming a probe element are provided. The probe element includes a carrier comprising biodegradable and/or bioactive material; and at least one electrode coupled to the carrier.Type: GrantFiled: October 29, 2010Date of Patent: August 12, 2014Assignee: Agency for Science, Technology and ResearchInventors: Levent Yobas, Ajay Agarwal, Ramana Murthy Badam, Rama Krishna Kotlanka, Xiang Jie Cyrus Foo
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Publication number: 20140030847Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.Type: ApplicationFiled: July 27, 2012Publication date: January 30, 2014Applicant: GLOBALFOUNDRIES SINGAPORE PTE. LTD.Inventors: Rama Krishna KOTLANKA, Rakesh KUMAR, Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI, Huamao LIN, Pradeep YELEHANKA
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Publication number: 20130324863Abstract: A guide wire arrangement, a strip arrangement, a method of forming a guide wire arrangement, and a method of forming a strip arrangement are provided. The guide wire arrangement includes a strip; a sensor being disposed on a first portion of the strip; a chip being disposed next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip; wherein the strip is folded at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions.Type: ApplicationFiled: November 2, 2011Publication date: December 5, 2013Inventors: Daquan Yu, Woo Tae Park, Li Shiah Lim, Muhammad Hamidullah, Rama Krishna Kotlanka, Vaidyanathan Kripesh, Hanhua Feng
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Patent number: 8513767Abstract: A method for forming a device is disclosed. A support substrate having first and second major surfaces is provided. An interconnect is formed through the first and second major surfaces in the support substrate. The interconnect has first and second portions. The first portion extends from one of the first or second major surfaces and the second portion extends from the other of the first and second major surfaces. The interconnect includes a partial via plug having a conductive material in a first portion of the interconnect. The via plug has a bottom at about an interface of the first and second portions. The second portion of the interconnect is heavily doped with dopants of a first polarity type.Type: GrantFiled: March 21, 2011Date of Patent: August 20, 2013Assignee: Globalfoundries Singapore Pte. Ltd.Inventors: Rama Krishna Kotlanka, Rakesh Kumar, Premachandran Chirayarikathuveedu Sankarapillai, Pradeep Ramachandramurthy Yelehanka
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Publication number: 20130053730Abstract: According to embodiments of the present invention, a micro-sensory tip for use in blood vessels is provided. The micro-sensory tip includes: a force transmission element; at least three force detecting sensors coupled to the force transmission element, each of the at least three force detecting sensors responsive to force applied on the force transmission element, wherein each of the at least three force detecting sensors produces an output representing at least one force component of a three-dimensional Cartesian co-ordinate system, of the force experienced by the force transmission element, such that the outputs of the at least three force detecting sensors can cover the space of the three-dimensional Cartesian co-ordinate system; and an active element arrangement coupled to the at least three force detecting sensors, the active element arrangement configured to process the output from the at least three force detecting sensors.Type: ApplicationFiled: August 27, 2010Publication date: February 28, 2013Applicants: National University of Singapore, Agency for Science, Technology and ResearchInventors: Rama Krishna Kotlanka, Vaidyanathan Kripesh, Daquan Yu, Kok Lim Chan, Soo Yeng Benjamin Chua, Pavel Neuzil
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Publication number: 20130053711Abstract: According to embodiments of the present invention, an implantable device for detecting variation in fluid flow rate is provided. The implantable device includes: a substrate having an active element arrangement; a sensor arrangement having a first portion that is mechanically secured and a second portion that is freely deflectable, the sensor arrangement in electrical communication with the active element arrangement, wherein the active element arrangement is configured to detect changes in deformation of the sensor arrangement and produce an output in response to the detected changes; and at least one inductive element mechanically coupled to the substrate and in electrical communication with the active element arrangement, wherein the inductive element is adapted to power the active element arrangement through inductive coupling to an excitation source, and wherein the inductive element is adapted to transmit the output associated with the detected changes in the sensor.Type: ApplicationFiled: September 27, 2010Publication date: February 28, 2013Inventors: Rama Krishna Kotlanka, Pradeep Basappa Khannur, Kok Lim Chan, Soo Yeng Benjamin Chua, Xiaojun Yuan, Minkyu Je, Vaidyanathan Kripesh, Daquan Yu, Pavel Neuzil, Lichun Shao, Woo Tae Park
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Publication number: 20130012801Abstract: A probe element and a method of forming a probe element are provided. The probe element includes a carrier comprising biodegradable and/or bioactive material; and at least one electrode coupled to the carrier.Type: ApplicationFiled: October 29, 2010Publication date: January 10, 2013Inventors: Levent Yobas, Ajay Agarwal, Ramana Murthy Badam, Rama Krishna Kotlanka, Xiang Jie Cyrus Foo
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Publication number: 20120241901Abstract: A method for forming a device is disclosed. A support substrate having first and second major surfaces is provided. An interconnect is formed through the first and second major surfaces in the support substrate. The interconnect has first and second portions. The first portion extends from one of the first or second major surfaces and the second portion extends from the other of the first and second major surfaces. The interconnect includes a partial via plug having a conductive material in a first portion of the interconnect. The via plug has a bottom at about an interface of the first and second portions. The second portion of the interconnect is heavily doped with dopants of a first polarity type.Type: ApplicationFiled: March 21, 2011Publication date: September 27, 2012Applicant: GLOBALFOUNDRIES SINGAPORE PTE. LTD.Inventors: Rama Krishna KOTLANKA, Rakesh KUMAR, Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI, Pradeep Ramachandramurthy YELEHANKA