Patents by Inventor Rama Puligadda
Rama Puligadda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220127496Abstract: A method is described for debonding a carrier and device substrate using a high-intensity, pulsed, broadband light system that is suitable for wafer-level packaging applications. The carrier substrate is a transparent wafer with a light absorbing layer on one side of the wafer. This method utilizes the high intensity light to rapidly heat up the light absorbing layer to decompose or melt a bonding material layer that is adjacent to the light absorbing layer. After exposure to light, the carrier substrate can be lifted off the surface of the device wafer with little or no force.Type: ApplicationFiled: October 18, 2021Publication date: April 28, 2022Inventors: Rama Puligadda, Xiao Liu, Luke M. Prenger, Xavier Martinez
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Patent number: 10968348Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.Type: GrantFiled: December 21, 2018Date of Patent: April 6, 2021Assignee: Brewer Science, Inc.Inventors: Xiao Liu, Qi Wu, Rama Puligadda, Dongshun Bai, Baron Huang
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Publication number: 20190194453Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.Type: ApplicationFiled: December 21, 2018Publication date: June 27, 2019Inventors: Xiao Liu, Qi Wu, Rama Puligadda, Dongshun Bai, Baron Huang
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Patent number: 9640396Abstract: Novel double- and triple-patterning methods are provided. The methods involve applying a shrinkable composition to a patterned template structure (e.g., a structure having lines) and heating the composition. The shrinkable composition is selected to possess properties that will cause it to shrink during heating, thus forming a conformal layer over the patterned template structure. The layer is then etched to leave behind pre-spacer structures, which comprise the features from the pattern with remnants of the shrinkable composition adjacent the feature sidewalls. The features are removed, leaving behind a doubled pattern. In an alternative embodiment, an extra etch step can be carried out prior to formation of the features on the template structure, thus allowing the pattern to be tripled rather than doubled.Type: GrantFiled: January 5, 2010Date of Patent: May 2, 2017Assignee: Brewer Science Inc.Inventors: Qin Lin, Rama Puligadda, James Claypool, Douglas J. Guerrero, Brian Smith
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Patent number: 9472436Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: May 8, 2014Date of Patent: October 18, 2016Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9263314Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: August 4, 2011Date of Patent: February 16, 2016Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9224631Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: February 27, 2014Date of Patent: December 29, 2015Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9127126Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.Type: GrantFiled: April 30, 2012Date of Patent: September 8, 2015Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Tony D. Flaim, Rama Puligadda, Susan Bailey
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Publication number: 20150122426Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: November 21, 2014Publication date: May 7, 2015Applicant: BREWER SCIENCE INC.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20140239453Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: May 8, 2014Publication date: August 28, 2014Applicant: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 8771442Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: GrantFiled: July 13, 2012Date of Patent: July 8, 2014Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
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Publication number: 20140174627Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: February 27, 2014Publication date: June 26, 2014Applicant: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20140162034Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: August 4, 2011Publication date: June 12, 2014Applicant: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20130288058Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.Type: ApplicationFiled: April 30, 2012Publication date: October 31, 2013Applicant: BREWER SCIENCE INC.Inventors: Wenbin Hong, Tony D. Flaim, Rama Puligadda, Susan Bailey
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Publication number: 20120291938Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: ApplicationFiled: July 13, 2012Publication date: November 22, 2012Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
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Patent number: 8221571Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: GrantFiled: December 15, 2010Date of Patent: July 17, 2012Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
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Publication number: 20120034437Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: August 4, 2011Publication date: February 9, 2012Applicant: BREWER SCIENCE INC.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 8092628Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: GrantFiled: October 31, 2008Date of Patent: January 10, 2012Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
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Publication number: 20110086955Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.Type: ApplicationFiled: December 15, 2010Publication date: April 14, 2011Applicant: BREWER SCIENCE INC.Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
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Publication number: 20100170868Abstract: Novel double- and triple-patterning methods are provided. The methods involve applying a shrinkable composition to a patterned template structure (e.g., a structure having lines) and heating the composition. The shrinkable composition is selected to possess properties that will cause it to shrink during heating, thus forming a conformal layer over the patterned template structure. The layer is then etched to leave behind pre-spacer structures, which comprise the features from the pattern with remnants of the shrinkable composition adjacent the feature sidewalls. The features are removed, leaving behind a doubled pattern. In an alternative embodiment, an extra etch step can be carried out prior to formation of the features on the template structure, thus allowing the pattern to be tripled rather than doubled.Type: ApplicationFiled: January 5, 2010Publication date: July 8, 2010Applicant: BREWER SCIENCE INC.Inventors: Qin Lin, Rama Puligadda, James Claypool, Douglas J. Guerrero, Brian Smith