Abstract: A cloud resource join query for join operations across cloud resources is parsed to extract join rules and queries to each cloud resource in the cloud resource join query. Results from the individual cloud queries are dynamically indexed based on pairs of cloud resources indicated in the join rules. A search engine applies first order predicates in the join rules using the dynamic indexes to generate pairwise join results corresponding to the query. A result for the cloud resource join query comprises the pairwise join results after merging.

Abstract: The present invention discloses complex for PET imaging in patients with Cushing's syndrome dependent on secretion of a hormone called ACTH from pituitary. This will help to distinguish Cushing's disease due to pituitary tumor (adenoma) or due to tumor of origin other than pituitary (ectopic Cushing's syndrome). It will also be helpful to delineate ACTH producing pituitary adenoma (corticotropinoma). More particularly the work disclosed an imaging complex comprising radiolabelled analogue of desmopressin for PET imaging to localize pituitary adenoma.

Abstract: A semiconductor memory device, also referred to as a solid state drive, includes thermally conductive components such as a conductive coating to draw heat away from the semiconductive package. The coating may also be electrically conductive to provide shielding from and absorption of electromagnetic interference. In examples, a semiconductor device including a substrate may be affixed to an edge connector printed circuit board with solder balls to form a solid state drive. In further examples, the substrate may be omitted, and semiconductor memory dies, a controller die and other electronic components may be directly surface mounted to an edge connector printed circuit board to form a solid state drive.

Abstract: A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level, mechanically resulting in the die pair having a minimum warpage. An electronic component may be bonded to an exposed surface of one of the semiconductor dies.

Abstract: A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. The semiconductor device may further include a CMOS logic circuit as part of the pair of semiconductor dies or in its own semiconductor die mounted to the pair of semiconductor dies.

Abstract: A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level, mechanically resulting in the die pair having a minimum warpage. An electronic component may be bonded to an exposed surface of one of the semiconductor dies.

Abstract: A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. The semiconductor device may further include a CMOS logic circuit as part of the pair of semiconductor dies or in its own semiconductor die mounted to the pair of semiconductor dies.