Patents by Inventor Ramachandra R. Revur

Ramachandra R. Revur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130098840
    Abstract: Disclosed are nano-engineered porous ceramic composite filtration media for removal of phosphorous contaminates from wastewater and other water or liquid sources. Such porous ceramic media has high surface area and an interconnecting hierarchical pore structure containing nano-iron oxide/oxyhydroxide compounds, as well as other nano materials, surfactants, ligands or other compounds appropriate for removing higher amounts of phosphorous or phosphorous compounds. The composite media can be modified with nano-phased materials grown on the high surface area and addition of other compounds, contains hierarchical, interconnected porosity ranging from nanometer to millimeter in size that provides high permeability substrate especially suited for removal of contaminants at the interface of the water or other fluids and the nanomaterial or surfactants residing on the surfaces of the porous structure.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 25, 2013
    Applicant: METAMATERIA TECHNOLOGIES, LLC
    Inventors: Richard Helferich, Ramachandra R. Revur, Suvankar Sengupta, J. Richard Schorr
  • Publication number: 20090218551
    Abstract: The invention provides a dense bulk thermoelectric composition containing a plurality of nanometer-sized particles of a thermoelectric material. The bulk composition provides thermoelectric power up to 550 ?V/° C. In some embodiments, the surface of each particle is coated by another thermoelectric material. The size of the particles ranges from about 5 nm to about 500 nm. The density of thermoelectric composition ranges from about 80% to about 100% of theoretical density.
    Type: Application
    Filed: November 29, 2006
    Publication date: September 3, 2009
    Inventors: Suvankar Sengupta, Ramachandra R. Revur, Troy Pyles
  • Publication number: 20090107584
    Abstract: Solder compositions and methods of forming solders are provided. The solder compositions exhibit desirable melting characteristics. In addition, the solder compositions may be useful in joining heat sensitive components such as sensors, system-in-package, memory, and MEMS devices.
    Type: Application
    Filed: September 29, 2008
    Publication date: April 30, 2009
    Applicant: NanoDynamics, Inc.
    Inventors: SUVANKAR SENGUPTA, Ramachandra R. Revur