Abstract: Methods and devices for solderless integration of multiple semiconductor dies on flexible substrates. In some embodiments, a method for solderless integration of multiple semiconductor dies on flexible substrates includes arranging one or a plurality of semiconductor dies on a first carrier, active side down, and then depositing a sacrificial material over them. In some embodiments, the method further includes removing the first carrier and then building a wafer-level redistribution layer (RDL) over the active side of the one or plurality of semiconductor dies and the sacrificial material. In some embodiments, the method includes patterning the wafer-level RDL to form an outline of a final module footprint and then applying a second carrier to the wafer-level RDL. In some embodiments, the method can also include removing the sacrificial material from the one or plurality of semiconductor dies and the wafer-level RDL to achieve an integration of the one or plurality of semiconductor dies.

Abstract: Methods and devices for solderless integration of multiple semiconductor dies on flexible substrates. In some embodiments, a method for solderless integration of multiple semiconductor dies on flexible substrates includes arranging one or a plurality of semiconductor dies on a first carrier, active side down, and then depositing a sacrificial material over them. In some embodiments, the method further includes removing the first carrier and then building a wafer-level redistribution layer (RDL) over the active side of the one or plurality of semiconductor dies and the sacrificial material. In some embodiments, the method includes patterning the wafer-level RDL to form an outline of a final module footprint and then applying a second carrier to the wafer-level RDL. In some embodiments, the method can also include removing the sacrificial material from the one or plurality of semiconductor dies and the wafer-level RDL to achieve an integration of the one or plurality of semiconductor dies.

Abstract: Methods and devices for solderless integration of multiple semiconductor dies on flexible substrates. In some embodiments, a method for solderless integration of multiple semiconductor dies on flexible substrates includes arranging one or a plurality of semiconductor dies on a first carrier, active side down, and then depositing a sacrificial material over them. In some embodiments, the method further includes removing the first carrier and then building a wafer-level redistribution layer (RDL) over the active side of the one or plurality of semiconductor dies and the sacrificial material. In some embodiments, the method includes patterning the wafer-level RDL to form an outline of a final module footprint and then applying a second carrier to the wafer-level RDL. In some embodiments, the method can also include removing the sacrificial material from the one or plurality of semiconductor dies and the wafer-level RDL to achieve an integration of the one or plurality of semiconductor dies.

Abstract: The present subject matter relates to systems and methods for wafer-level manufacturing of devices having land grid array interfaces. Such devices can include a semiconductor die comprises an active surface including one or more electrical contacts, conductive studs in a directly metallized connection with the electrical contacts, an over-mold structure substantially surrounding the active surface of the semiconductor die and the conductive studs, and conductive contacts formed in an outer surface of the over-mold structure. In this configuration, each of the conductive contacts is connected to one of the conductive studs, and the conductive contacts define a land grid array interface on the outer surface of the over-mold structure.