Abstract: The present invention provides a method for converting the topological charge of an orbital angular momentum mode of light to an opposite topological charge by applying the light to a spool of optical fiber having a bend radius R and length L. The length of the fiber used to form the spool is defined by ½ the bend-induced 2? walk-off length Ll,mb(2?). The length of the fiber L and the bend radius R of the spool may be adjusted to account for an ellipticity-induced 2? walk-off length Ll,m3(2?). Using the proportionality rules, Ll,mb(2?)?R2l and Ll,m3(2?)???l adjustments to account for ellipticity induced 2? walk-off length Ll,me(2?), or to account for a change in the bend radius ?R of the spool can be easily determined.

Abstract: A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

Abstract: A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

Abstract: A device and method of minimally incrementing and decrementing the weights of a minimal number of links in a network to cause a link/node that is not in the shortest path in the network to be in the shortest path by determining the shortest path with link/node, identifying links in this path that are not in the shortest path without link/node, decrementing identified links to make the path the shortest path, identifying a link in the shortest path without link/node not in the path with link/node, incrementing the link, redoing these steps to determine a number of links and modifications to links that would cause the link/node to appear in the shortest path, identifying the set of links and modifications with the fewest links, and modifying the network in accordance with the identified set.

Abstract: A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.