Patents by Inventor Ramesh Mehta

Ramesh Mehta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150358414
    Abstract: Inference based event notification techniques are described. In one or more implementations, user preferences are inferred based on monitored interaction of the user with at least one computing device. One or more events are located that correspond to the inferred user preferences and are likely to be available to the user based on an examination of a calendar of the user that is performed automatically and without user intervention. An option is output in a user interface that is selectable by a user to obtain credentials to attend the located one or more events.
    Type: Application
    Filed: June 10, 2014
    Publication date: December 10, 2015
    Inventors: Sujeet Ramesh Mehta, Jeffrey Jay Johnson
  • Patent number: 5443674
    Abstract: A method of binding book blocks to form books is disclosed. The method involves applying an aqueous composition to the spine area of a book block and removing the volatile components of the composition. The composition comprises (1) an aqueous vehicle, a film-forming polymeric resin, and a polyurethane resin or (2) an aqueous polyurethane dispersion or emulsion. The composition may also include an alkaline component. In another embodiment, the composition comprises a mixture of an aqueous, film-forming polymeric latex, an alkaline component to adjust the pH the latex to that of an aqueous polyurethane dispersion, and the aqueous polyurethane dispersion.
    Type: Grant
    Filed: August 31, 1992
    Date of Patent: August 22, 1995
    Assignee: H. B. Fuller Licensing & Financing Inc.
    Inventors: Flavia M. Fresonke, Ramesh Mehta
  • Patent number: 4082708
    Abstract: The disclosed adhesive system comprises a curable liquid epoxide and a bisamino piperazine-containing thermoplastic polyamide hardener or co-curative. This adhesive system forms high strength metal-to-metal bonds with unusually high T-peel strength, high tensile shear strength, excellent low temperature properties, and good impact resistance while possessing the fast assembly speed characteristics of a hot melt. Both two-part and stable one-part curable systems can be formulated from (a) suitable epoxy resins and (b) the bisamino piperazine-containing thermoplastic polyamide.The particularly preferred polyamide comprises the amidification product, at temperatures of from 180.degree. C. to 300.degree. C.
    Type: Grant
    Filed: September 20, 1976
    Date of Patent: April 4, 1978
    Assignee: H. B. Fuller Company
    Inventor: Ramesh Mehta