Abstract: Systems and related accessing methods for remote unit assemblies for distributed communications systems are provided. A support member (e.g., a support plate) is arranged to be mounted in a drop ceiling grid, and a pivotally mounted pivot arm arranged above the support plate is configured to receive at least one electronic component. The pivot arm allows the electronic component to pivot downwardly from a ceiling structure for easier access. A slow release mechanism is configured to reduce a rate of pivotal motion of the pivot arm. A retention mechanism selectively retains the electronic component in a substantially horizontal position proximate to the support plate. A vented antenna cover below the support plate is pivotally mounted to the electronic component with at least one pivotal link, and may include an integrated antenna.

Abstract: Disclosed herein is a light launch device with improved usability and performance. In particular, the light launch device includes an internally housed launch cable and emission connector, a removable faceplate, alternating laser emission, and/or optimized pulse emission. The internally housed launch cable and emission connector facilitate portability and ease of use by consolidating the various components of the light launch device. The removable faceplate is positioned over the bulkhead connected to the input connector of a launch cable assembly to prevent access to the connection during normal use but selectively allowing access for maintenance or launch cable assembly replacement. The alternating laser emissions and/or optimized pulse emission decreases power consumption and/or maintains or improves cable tracing effectiveness.

Abstract: Systems and related accessing methods for remote unit assemblies for distributed communications systems are provided. A support member (e.g., a support plate) is arranged to be mounted in a drop ceiling grid, and a pivotally mounted pivot arm arranged above the support plate is configured to receive at least one electronic component. The pivot arm allows the electronic component to pivot downwardly from a ceiling structure for easier access. A slow release mechanism is configured to reduce a rate of pivotal motion of the pivot arm. A retention mechanism selectively retains the electronic component in a substantially horizontal position proximate to the support plate. A vented antenna cover below the support plate is pivotally mounted to the electronic component with at least one pivotal link, and may include an integrated antenna.

Abstract: Remote units are mounted in a support structure so that cooling air flow is not impeded by the support structure. The remote units may have RF communications circuitry and other components that generate heat in the provision of wireless services.

Abstract: Remote units are mounted in a support structure so that cooling air flow is not impeded by the support structure. The remote units may have RF communications circuitry and other components that generate heat in the provision of wireless services.

Abstract: Remote units are mounted in a support structure so that cooling air flow is not impeded by the support structure. The remote units may have RF communications circuitry and other components that generate heat in the provision of wireless services.

Abstract: A fan module is removable from an electronic component by opening a hinged door of the component and removing the fan module from the door. The fan module is removably received within a slot or recess in the door, and is installed or de-installed in a direction non-coincident with the pivotal motion of the door. Removal of the fan module prior to pivotal movement of the door is prevented with a screw mechanism and/or an interlock tab associated with a retractable handle provided in a recess along a top surface of the fan module.

Abstract: An electronic apparatus includes first and second electronic devices, and first and second heat sinks for dissipating heat, wherein there is each of electrical conductivity between the first electronic device and the first heat sink, thermal conductivity between the first electronic device and the first heat sink, electrical conductivity between the second electronic device and the second heat sink, and thermal conductivity between the second electronic device and the second heat sink, wherein electrical conductivity is provided between the first and second heat sinks, and wherein thermal resistance is provided between the first and second heat sinks, so that the second heat sink remains cooler than the first heat, such as for protecting the second electrical device from the heat generated by the first electronic device.

Abstract: Remote units are mounted in a support structure so that cooling air flow is not impeded by the support structure. The remote units may have RF communications circuitry and other components that generate heat in the provision of wireless services.