Abstract: A method and an integrated system. The integrated system can include an optical inspection unit, a charged particle device, an interface unit, and at least one controller.

Abstract: A method and an integrated system. The integrated system can include an optical inspection unit, a charged particle device, an interface unit, and at least one controller.

Abstract: A scanning system that includes an illumination module that is configured to scan, at a first direction, an elongated radiation spot over an object; and a collection module that is configured to (a) collect a collected radiation beam from the object, and (b) optically manipulate the collected radiation beam to provide a counter-scan beam is directed towards a set of detection units and has a focal point that is positioned at a same location regardless of the propagation of the elongated radiation spot along the first direction.

Abstract: A scanning system that includes an illumination module that is configured to scan, at a first direction, an elongated radiation spot over an object; and a collection module that is configured to (a) collect a collected radiation beam from the object, and (b) optically manipulate the collected radiation beam to provide a counter-scan beam is directed towards a set of detection units and has a focal point that is positioned at a same location regardless of the propagation of the elongated radiation spot along the first direction.

Abstract: A method for inspecting a plurality of dies, that are typically disposed on a surface of a semiconducting wafer. Each of the dies includes respective functional features within the die. The method consists of identifying within a first die a first multiplicity of the functional features having respective characteristics, and measuring respective first locations of the first multiplicity with respect to an origin of the first die. Within a group of second dies a second multiplicity of the functional features having the respective characteristics is identified, respective second locations of the second multiplicity are measured. The second locations are compared to the first locations to determine a location of an origin of the group of the second dies.

Abstract: A method for inspecting a plurality of dies, that are typically disposed on a surface of a semiconducting wafer. Each of the dies includes respective functional features within the die. The method consists of identifying within a first die a first multiplicity of the functional features having respective characteristics, and measuring respective first locations of the first multiplicity with respect to an origin of the first die. Within a group of second dies a second multiplicity of the functional features having the respective characteristics is identified, respective second locations of the second multiplicity are measured. The second locations are compared to the first locations to determine a location of an origin of the group of the second dies.

Abstract: In a method and apparatus for compensating for static and dynamic inaccuracies in an optical scanner used in a typical surface inspection system, the scanner may have a scanning axis and a cross-scanning axis. A surface of an inspection article is scanned along a scanning axis and a scanning axis signal is output at predetermined distances along this axis. The scanning axis signal may be used to determine a speed of relative movement between the scanner and the inspection article. A jitter signal may be output whenever the scanner deviates from the scanning axis, and this signal may be used to calculate the amount of deviation. Information, such as the speed of relative movement, scan line resolution, and a scanning axis static position error may be used to generate a scan line. A generated scan line may be shifted to compensate for a cross-scanning axis error.

Abstract: In a method and apparatus for compensating for static and dynamic inaccuracies in an optical scanner used in a typical surface inspection system, the scanner may have a scanning axis and a cross-scanning axis. A surface of an inspection article is scanned along a scanning axis and a scanning axis signal is output at predetermined distances along this axis. The scanning axis signal may be used to determine a speed of relative movement between the scanner and the inspection article. A jitter signal may be output whenever the scanner deviates from the scanning axis, and this signal may be used to calculate the amount of deviation. Information, such as the speed of relative movement, scan line resolution, and a scanning axis static position error may be used to generate a scan line. A generated scan line may be shifted to compensate for a cross-scanning axis error.