Patents by Inventor Ramin Azadeh

Ramin Azadeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and a method for applying a plurality of solder globules to a substrate
    Patent number: 6059176
    Abstract: A method for applying a plurality of solder globules to a substrate has a solder-globule fixing method, a plurality of glass fibers and a fibre holder. The solder-globule fixing method has provided therein a plurality of passages whose cross-sectional areas are smaller than the cross-sectional areas ofthe solder globules to be applied. The fibre holder is arranged relative to the solder-globule fixing device in such a way that between the fibre holder and the solder-globule fixing device a cavity is formed, which is adapted to be acted upon when submitted to pressure via a pressure-transmitting conduit. The fibre holder holds the glass fibres in alignment with the passages.
    Type: Grant
    Filed: April 7, 1998
    Date of Patent: May 9, 2000
    Assignee: Pac Tech Packaging Technologies G.m.b.H.
    Inventors: Ghassem Azdasht, Ramin Azadeh, Clemens Ruthnick, Martin Lange