Abstract: A flexible photovoltaic (PV) cell having enhanced properties of mechanical impact absorption, includes: a semiconductor wafer that is freestanding and carrier-less; having a thickness, and having a first surface, and a having second surface that is opposite to that first surface; a set of non-transcending gaps within the semiconductor wafer. Each non-transcending gap penetrates from the first surface towards the second surface but reaches to a depth of between 80 to 99 percent of the thickness of the semiconductor wafer, and does not reach said second surface. Each non-transcending gap does not entirely penetrate through an entirety of the thickness of the semiconductor wafer. The semiconductor wafer maintains at least 1 percent of the thickness of the semiconductor wafer as an intact and non-penetrated thin layer of semiconductor wafer that remains intact and non-penetrated by the non-transcending gaps. The intact and non-penetrated thin layer of semiconductor wafer absorbs and dissipates mechanical forces.

Abstract: Rubber molded articles that integrally incorporate an operable photovoltaic device, and method and system for producing such articles. An apparatus includes a rubber body, formed of one or more solidified, compacted, previously-heated rubber materials, selected from the group consisting of: virgin unused rubber material, recycled rubber, scrap rubber, rubber pellets, rubber granules, rubber lumps, rubber strips. The apparatus also includes an operable photovoltaic device, that is configured to generate electricity from light via the photovoltaic effect; and which is optionally flexible and rollable. The operable photovoltaic device is integrally held on top of the rubber body, via a molded connection and holding mechanism which molds together the rubber body and the operable photovoltaic device.

Abstract: Injection molded, blow molded, and rotational molded articles that integrally incorporate an operable photovoltaic device, and method and system for producing such articles. A method includes: placing an operable photovoltaic device at an inner-side of a mold cavity of a mold; performing injection molding or reaction injection molding or blow molding or rotational molding, of raw plastic materials or raw polymeric materials; and forming a single or singular, monolithic, unified or uniform, molded article that integrally incorporates and fixedly holds and tightly secures, therein or thereon, the operable photovoltaic device, directly and securely and tightly via the solidified molded plastic or the solidified molded polymer that are adjacent to it.

Abstract: A hybrid photovoltaic (PV) device includes: a rigid PV segment, having one or more PV cells that convert light to electricity, wherein the rigid PV segment is non-foldable and non-bendable; a co-located flexible PV segment, wherein the flexible PV segment is foldable or bendable without being damaged; electric connectors, that connect between (i) electric current or voltage generated by the rigid PV segment, and (ii) electric current or voltage generated by the flexible PV segment; a unified encapsulation layer, encapsulating together both the rigid PV segment and the co-located flexible PV segment. The rigid PV segment, the co-located flexible PV segment, the electric connectors, and the unified encapsulation layer, form together the hybrid PV device as a single stand-alone PV device that converts light to electricity, and has at least one rigid region corresponding to the rigid PV segment and at least one flexible region corresponding to the co-located flexible PV segment.

Abstract: A flexible photovoltaic (PV) cell having enhanced properties of mechanical impact absorption, includes: a semiconductor wafer that is freestanding and carrier-less; having a thickness, and having a first surface, and a having second surface that is opposite to that first surface; a set of non-transcending gaps within the semiconductor wafer. Each non-transcending gap penetrates from the first surface towards the second surface but reaches to a depth of between 80 to 99 percent of the thickness of the semiconductor wafer, and does not reach said second surface. Each non-transcending gap does not entirely penetrate through an entirety of the thickness of the semiconductor wafer. The semiconductor wafer maintains at least 1 percent of the thickness of the semiconductor wafer as an intact and non-penetrated thin layer of semiconductor wafer that remains intact and non-penetrated by the non-transcending gaps. The intact and non-penetrated thin layer of semiconductor wafer absorbs and dissipates mechanical forces.

Abstract: Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit toughened physical characteristics making them more suitable for use in mechanically challenging or stressful environments. Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit toughened thermal characteristics making them more suitable for use in environmentally challenging applications. Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit sufficiently toughened characteristics and increase impact resistance to permit packaging in non-rigid and light weight encapsulating layer(s). Semiconductor substrates and semiconductor devices produced from such substrates may exhibit sufficient flexibility to permit for rolling up during shipment and or for non-destructive deformation during deployment over uneven surfaces.

Abstract: Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit toughened physical characteristics making them more suitable for use in mechanically challenging or stressful environments. Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit toughened thermal characteristics making them more suitable for use in environmentally challenging applications. Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit sufficiently toughened characteristics and increase impact resistance to permit packaging in non-rigid and light weight encapsulating layer(s). Semiconductor substrates and semiconductor devices produced from such substrates may exhibit sufficient flexibility to permit for rolling up during shipment and or for non-destructive deformation during deployment over uneven surfaces.