Patents by Inventor Ramon R. Campa

Ramon R. Campa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Use of hybrid PCB materials in printed circuit boards
    Patent number: 9820374
    Abstract: A apparatus comprising a printed circuit board (“PCB”). The PCB comprises a first insulating layer and a second insulating layer. The first insulating layer is made of a first material and the second insulating layer is made of a second material. The first material has a lower dissipation factor than the second material. The first material and second material have substantially similar dielectric constants.
    Type: Grant
    Filed: August 30, 2008
    Date of Patent: November 14, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Karl J. Bois, Ramon R. Campa
  • USE OF HYBRID PCB MATERIALS IN PRINTED CIRCUIT BOARDS
    Publication number: 20110157842
    Abstract: A apparatus comprising a printed circuit board (“PCB”). The PCB comprises a first insulating layer and a second insulating layer. The first insulating layer is made of a first material and the second insulating layer is made of a second material. The first material has a lower dissipation factor than the second material. The first material and second material have substantially similar dielectric constants.
    Type: Application
    Filed: August 30, 2008
    Publication date: June 30, 2011
    Inventors: Karl J Bois, Ramon R. Campa