Abstract: A high power laser system including: a plurality of emitters each including a large area waveguide and a plurality of quantum well regions optically coupled to the large area waveguide, wherein each of the quantum well regions exhibits a low modal overlap with the large area waveguide; a collimator optically coupled to the emitters; a diffraction grating optically coupled through the collimator to the emitters; and, an output coupler optically coupled through the diffraction grating to the emitters.

Abstract: An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients and an amorphans silicon a corbide layer.

Abstract: An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients.

Abstract: A photoconductive detector comprises a substrate layer of semiconductor material of a first conductivity type substantially transparent of light at the wavelength to be detected and doped sufficiently to provide ohmic contact to the photoconductive active region overlying said substrate layer. The active region comprises a body of undoped semiconductor material absorptive of light at the wavelength to be detected, having first and second major surfaces. The substrate layer serves as a first ohmic contact for the entire first major surface of the active region and a metal or metal alloy serves as a second ohmic contact overlying the entire second major surface of said active region.

Abstract: A photodetector comprising a light absorptive region, a wide bandgap region adjacent to the light absorptive region and a region of a first conductivity type extending through the wide bandgap region into the light absorptive region is improved by the incorporation of a lattice matched, intermediate bandgap region between the wide bandgap region and the light absorptive region. The p-n junction lies in the intermediate bandgap region in proximity to the interface thereof with the light absorptive region. The quantum efficiency of the disclosed device is significantly improved over prior art devices.

Abstract: A semiconductor device structure incorporates a semiconductor wafer having first and second opposing major surfaces and an edge. A first region of first conductivity type is contiguous with the second surface and includes an edge portion which is contiguous with the wafer edge at the first surface. A second region, of second conductivity type, extends into the wafer from the first surface so as to form a PN junction with the first region at a predetermined depth from the first surface. A third region, of second conductivity type, extends into the wafer from the first surface to a depth greater than the predetermined depth. The third region is disposed between and is contiguous with the second region and the edge portion of the first region. When the wafer is silicon the third region has an areal charge concentration of approximately 1 to 2.times.10.sup.12 cm.sup.-2.

Abstract: A vertical MOSFET includes source and gate electrodes on a major semiconductor surface, and a drain electrode on an opposing semiconductor surface. A shield electrode is disposed in proximity to the gate electrode so as to minimize feedback capacitance between the gate electrode and drain region. Additionally, the shield electrode increases the level of space charge limited current that can be supported in the drain region, and minimizes current crowding in the device.

Abstract: A high-current, high-voltage semiconductor device is fabricated on a metallurgical grade substrate of a first conductivity type by first growing an epitaxial layer of the first conductivity type on the substrate and then fabricating a semiconductor device thereon designed for high-current, high-voltage applications.

Abstract: A semiconductor transistor device comprises a base region having a relatively thin portion with a thicker portion peripherally surrounding the relatively thin portion. A PN junction is between the base region and a collector region and includes at least one radius of curvature having the lowest breakdown voltage of the PN junction. An emitter region is in the thicker portion of the base region and an emitter electrode overlies the relatively thin portion.